Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Kazuhiko Honjo

Eiji Kawamoto

Junichi Kimura

Motoyoshi Kitagawa

Tadashi Nakamura

Yasuhiro Sugaya

Toshiyuki Asahi

Tatsuo Sasaoka

Shinji Harada

Shin Okumura

Shuhei Uchiyama

Chie Sasaki

Toshihiko Mori

The solid content contains a resin component (A) and a filler (B). The resin component (A) includes at least one of a fluorine-containing copolymer (a1) or a silicon-containing copolymer (a2). The fluorine-containing copolymer (a1) includes a fluorine-containing segment and an acrylic segment containing no fluorine or silicon. The silicon-containing copolymer (a2) includes a silicon-containing segment and an acrylic segment containing no fluorine or silicon. The filler (B) has a mean particle size falling within a range from 10 nm to 200 nm.

Antifouling coating composition, optical member, and light fixture

A three-dimensional circuit board includes a lower substrate, a connection layer provided on an upper surface of the lower substrate, and an upper substrate provided on an upper surface of the connection layer. The connection layer exposes a portion of the upper surface of the lower substrate. The connection layer includes an insulating layer having a through-hole, and a via-conductor made of conductive material filling the through-hole. A recess is provided directly above the portion of the upper surface of the lower substrate and is surrounded by a side surface of the upper substrate and a side surface of the connection layer. A portion of the upper surface of the connection layer connected to the side surface of the connection layer inclines in a direction toward the portion of the upper surface of the lower substrate. The portion of the upper surface of the connection layer is provided from the side surface of the connection layer to the via-conductor. A portion of an upper substrate of the upper substrate connected to the side surface of the upper substrate inclines in a direction toward the portion of the upper surface of the lower substrate. The circuit board allows a component to be mounted in the recess efficiently.

Three-dimensional wiring board

A passive component incorporating interposer includes a double-sided circuit board () having a wiring layer () on both sides, a passive component () mounted on the wiring layer () on one surface of the double-sided circuit board (), a second insulating layer () made of woven fabric or non-woven fabric or inorganic filler and thermosetting resin laminated on the surface of the double-sided circuit board () mounted with the passive component (), a first insulating layer () made of woven fabric or non-woven fabric or inorganic filler and thermosetting resin laminated on the other surface of the double-sided circuit board () not mounted with the passive component (), first and second wiring layers () formed on the first and second insulating layers (), and a through hole () for electrically connecting the wiring layers () disposed on both surfaces of the double-sided circuit board () and the first and second wiring layers (), where the first wiring layer () is formed to enable mounting of a semiconductor element ().

Passive component incorporating interposer

The printed wiring board (PWB) includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.

Method of manufacturing component-embedded printed wiring board

A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.

Multilayer module and method of manufacturing the same

Growing community of inventors

Osaka, Japan

Kazuhiko Honjo