Fujitsu Corporation

Kazuhiko Harada

Yukio Miyazaki

Takuya Amemiya

Yoshifumi Mizoshita

Takeshi Ohwe

A method for assembling a magnetic head assembly with a slider and a magnetic head including forming, on a slider supporting member, a terminal connected to a magnetic head terminal. In addition, the method includes fixing a head slider on the slider supporting member so that the head terminal faces the terminal of the slider supporting member and contacting a conductive ball member to both of the head terminal and the terminal of the slider supporting member. Furthermore, the method includes pressing the ball member to bond the head terminal with the terminal of the slider supporting member so that the ball member connects the terminals electrically and mechanically.

Method for assembling a magnetic head assembly and magnetic disk drive using bonding balls connecting magnetic head terminals to wiring terminals

This invention relates to a magnetic head assembly for information recording and reproduction on and from a magnetic disk using a magnetic head, a method manufacturing the same and a magnetic disk apparatus. A head chip has an insulating layer, a magnetic pole and a coil with a terminal portion. A flexible support body has a lead portion and a terminal portion to be connected to the terminal portion of the head chip. The flexible support body is attached to the arm for supporting the head chip.

Magnetic head assembly with contact-type head chip mounting and

This invention relates to a magnetic head assembly for information recording and reproduction on and from a magnetic disk using a magnetic head, a method of manufacturing the same and a magnetic disk apparatus. To provide a magnetic head at a low cost, a head chip (1) having an insulating layer, a magnetic pole (16), a coil (17) and a terminal portion (11, 13) of the coil, and a flexible support body (2) having a lead portion and a terminal portion (21, 23) to be connected to the terminal portion of the head chip (1), and attached to the arm (3), for supporting the head chip (1) are provided.

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Kawasaki, Japan

Kazuhiko Harada