Fujikura Limited

Nippon Telegraph and Telephone Corporation

Nof Corporation

Kazuhiko Goto

Yuji Saito

Masataka Mochizuki

Koichi Mashiko

Yoshihiro Nagaki

Thang Toan Nguyen

Katsuo Eguchi

Tohru Takahashi

Hisatoshi Kasahara

Norihiro Fujimoto

Hitoshi Mizuno

Hitoshi Hasegawa

Seiya Sato

Akihiro Takamiya

Shiro Nakayama

Izumi Ishikawa

Kenji Matsui

Toshio Niwa

Thoru Nakatsuka

Hiroyuki Miyata

Mitutaka Tanida

An object is to estimate the course of a movable terminal device. An information processing system (S) includes a plurality of transmission devices () capable of transmitting predetermined radio waves, a terminal device () capable of receiving the predetermined radio waves, and a management device () communicably connected to the terminal device. The terminal device () measures intensities of radio waves received from the transmission devices () at predetermined times, and transmits measurement results to the management device (). The management device () calculates distances between the terminal device () and each of the transmission devices () at the predetermined times from the measurement results, and calculates positions of the terminal device () at the predetermined times from the calculated distances.

Information processing system, information processing method, management device, and program

An electronic device cooler for cooling an exothermic member arranged in a case, comprises: an air compressor for adiabatically compressing the air in the case; a heat pipe for discharging the heat of the air, which is compressed to have an elevated temperature by the air compressor, to the outside of the case; and an expansion turbine for adiabatically expanding the pressurized air, which is derived of its heat by the heat pipe, to cool it.

Cooler for electronic devices

A process for manufacturing a heat sink, in which a plate-shaped base portion is formed by the diecasting method integrally with the one-end portions of a plurality of fins arrayed at a constant pitch and in parallel with each other.

Heat sink, and process and apparatus for manufacturing the same

A process for manufacturing a heat sink, in which a plate-shaped base portion is formed by the diecasting method integrally with the one-end portions of a plurality of fills arrayed at a constant pitch and in parallel with each other.

A cooling device for a notebook personal computer which has a personal computer body accommodating an exothermic electronic element and a display hinged in an openable/closable manner to the personal computer body through a hinge mechanism, including a first heat pipe having a first end portion arranged along the display and a second end portion arranged in parallel with a center line of rotation of said hinge mechanism; a second heat pipe having a first end portion arranged on the electronic element in a heat transferable manner and a second end portion arranged in thermal contact with the second end portion of said first heat pipe; and a connector defining a first hole having an axis and configured to receive the second portion of the first heat pipe, a second hole having an axis different from the axis of the first hole and configured to receive the second portion of the second heat pipe, the first and second holes communicating with each other; wherein at least one of the second end portions is positioned on the center line of rotation of the hinge mechanism. The connector and one of the heat pipes, having a relatively rotatable second end portion, can form a hinge between the personal computer body and the display.

Cooling device for notebook personal computer

An electronic device cooler for cooling an exothermic member arranged in a case, including an air compressor configured to compress adiabatically air in the case to an elevated temperature. Also included is a heat pipe configured to discharge heat from the air adiabatically compressed to the elevated temperature to an outside of said case, and an expansion turbine configured to expand adiabatically the air having heat discharged by the heat pipe to a reduced temperature.

A polyethylene composition which is useful in insulations and joints of extra-high voltage power cables, and in which a cross-linking agent, comprising an organic peroxide subjected to purification processing, and an antioxidant, are blended, wherein the cross-linked composition has a dielectric loss tangent (tan.delta.) of less than or equal to 0.07% at a temperature of 90.degree. C. and under an electric field stress of 20 kV/mm. This polyethylene composition exhibits little dielectric loss, even at high temperatures or high electric field stresses, and is optimally employed in insulations and joints for extra-high voltage power cables of 275 kV or more.

Polyethylene composition for use in insulations and joints of extra-high

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Tokyo, Japan

Kazuhiko Goto