Jx Nippon Mining Metals Corporation

Nikko Metal Manufacturing Co., Ltd.

Kazuhiko Fukamachi

Yoshitaka Shibuya

Atsushi Kodama

Hiroshi Kuwagaki

Naohiko Era

Kazuki Kanmuri

The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials. The metallic material for electronic components includes: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from a constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; and an upper layer formed on the intermediate layer, the upper layer being constituted with an alloy composed of one or two or more selected from the constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir and one or two selected from a constituent element group C, namely, the group consisting of Sn and In; wherein the thickness of the lower layer is 0.05 &#x3bc;m or more and less than 5.00 &#x3bc;m; the thickness of the intermediate layer is 0.01 &#x3bc;m or more and less than 0.50 &#x3bc;m; and the thickness of the upper layer is 0.02 &#x3bc;m or more and less than 0.80 &#x3bc;m.

Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same

The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials. The metallic material for electronic components includes: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer including an alloy constituted with one or two or more selected from a constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and one or two selected from a constituent element group C, namely, the group consisting of Sn and In; and an upper layer formed on the intermediate layer, the upper layer being constituted with one or two selected from a constituent element group C, namely, the group consisting of Sn and In; wherein the thickness of the lower layer is 0.05 &#x3bc;m or more and less than 5.00 &#x3bc;m; the thickness of the intermediate layer is 0.02 &#x3bc;m or more and less than 0.80 &#x3bc;m; and the thickness of the upper layer is 0.005 &#x3bc;m or more and less than 0.30 &#x3bc;m.

The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials. The metallic material for electronic components includes: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from a constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; an upper layer formed on the intermediate layer, the upper layer being constituted with an alloy composed of one or two or more selected from the constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir and one or two selected from a constituent element group C, namely, the group consisting of Sn and In; an outermost layer formed on the upper layer, the upper layer being constituted with one or two selected from the constituent element group C, namely, the group consisting of Sn and In, wherein the thickness of the lower layer is 0.05 &#x3bc;m or more and less than 5.00 &#x3bc;m; the thickness of the intermediate layer is 0.01 &#x3bc;m or more and less than 0.50 &#x3bc;m; the thickness of the upper layer is less than 0.50 &#x3bc;m; and the thickness of the outermost layer is 0.005 &#x3bc;m or more and less than 0.30 &#x3bc;m.

The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials. The metallic material for electronic components includes: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from the constituent element group A and one or two selected from a constituent element group B, namely, the group consisting of Sn and In; and an upper layer formed on the intermediate layer, the upper layer being constituted with one or two selected from the constituent element group B and one or two or more selected from a constituent element group C, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; wherein the thickness of the lower layer is 0.05 &#x3bc;m or more and less than 5.00 &#x3bc;m; the thickness of the intermediate layer is 0.01 &#x3bc;m or more and less than 0.40 &#x3bc;m; and the thickness of the upper layer is 0.02 &#x3bc;m or more and less than 1.00 &#x3bc;m.

There are provided an electronic component metal material having low insertability/extractability, low whisker formability and high durability, and a method for manufacturing the electronic component metal material. The electronic component metal materialincludes a base material, an A layerconstituting an outermost surface layer on the base materialand formed of Sn, In or an alloy thereof, and a B layerconstituting a middle layer provided between the base materialand the A layerand formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer)has a thickness larger than 0.2 &#x3bc;m, and the middle layer (B layer)has a thickness of 0.001 &#x3bc;m or larger.

Electronic component metal material and method for manufacturing the same

There are provided a press-fit terminal which has an excellent whisker resistance and a low inserting force, is unlikely to cause shaving of plating when the press-fit terminal is inserted into a substrate, and has a high heat resistance, and an electronic component using the same. A press-fit terminal comprises: a female terminal connection part provided at one side of an attached part to be attached to a housing; and a substrate connection part provided at the other side and attached to a substrate by press-fitting the substrate connection part into a through-hole formed in the substrate. At least the substrate connection part has the surface structure described below, and the press-fit terminal has an excellent whisker resistance. The surface structure comprises: an A layer formed as an outermost surface layer and formed of Sn, In, or an alloy thereof; a B layer formed below the A layer and constituted of one or two or more selected from the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir; and a C layer formed below the B layer and constituted of one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co, and Cu. The A layer has a thickness of 0.002 to 0.2 &#x3bc;m. The B layer has a thickness of 0.001 to 0.3 &#x3bc;m. The C layer has a thickness of 0.05 &#x3bc;m or larger.

Press-fit terminal and electronic component using the same

There are provided an electronic component metal material which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The electronic component metal materialincludes a base material, an A layerconstituting an outermost surface layer on the base materialand formed of Sn, In or an alloy thereof, and a B layerconstituting a middle layer provided between the base materialand the A layerand formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer)has a thickness of 0.002 to 0.2 &#x3bc;m, and the middle layer (B layer)has a thickness larger than 0.3 &#x3bc;m.

There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal materialfor electronic components has a base material, an A layerconstituting a surface layer on the base materialand formed of Sn, In or an alloy thereof, and a B layerconstituting a middle layer provided between the base materialand the A layerand formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer)has a thickness of 0.002 to 0.2 &#x3bc;m, and the middle layer (B layer)has a thickness of 0.001 to 0.3 &#x3bc;m.

Metal material for electronic component and method for manufacturing the same

The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 &#x3bc;m or more; the thickness of the upper layer is 0.005 &#x3bc;m or more and 0.6 &#x3bc;m or less; and in the upper layer, the relation between the ratio, the constituent elements A/(the constituent elements A+the constituent elements B) [mass %] (hereinafter, referred to as the proportion of Sn+In) and the plating thickness [&#x3bc;m] is given byplating thickness&#x2266;8.2&#xd7;(proportion of Sn+In)[herein, (the proportion of Sn+In)&#x2267;10 mass %].

Metallic material for electronic components, and connector terminals, connectors and electronic components using same

The invention provides Cu&#x2014;Ni&#x2014;Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4&#x2266;[Ni+Co]/Si&#x2266;about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5&#x2266;Ni/Co&#x2266;about 2.

Copper alloy for electronic materials

The invention provides Cu&#x2014;Ni&#x2014;Si&#x2014;Co&#x2014;Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu&#x2014;Ni&#x2014;Si&#x2014;Co&#x2014;Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5 -about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09 -about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4&#x2266;[Ni+Co]/Si&#x2266;about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5&#x2266;Ni/Co&#x2266;about 2, and wherein Pc is equal to or less than about 15/1000 &#x3bc;m, or Pc/P is equal to or less than about 0.3 wherein P is the number of inclusions dispersed in the alloy and having the size of 1 &#x3bc;m or more, and Pc is the number of inclusions, among those having the size of 1 &#x3bc;m or more, whose carbon concentration is 10% or more by weight.

Cu&#x2014;Ni&#x2014;Si&#x2014;Co&#x2014;Cr copper alloy for electronic materials and method for manufacturing same

The present invention provides a Cu&#x2014;Cr&#x2014;Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu&#x2014;Zr alloy having a diameter of 0.1 &#x3bc;m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm.

Growing community of inventors

Hitachi, Japan

Kazuhiko Fukamachi