Hitachi Maxell, Limited

Hitachi Maxwell, Ltd.

Kazuhiko Daido

Wasao Takasugi

Toshinobu Sueyoshi

Ryuzo Fukao

Kyouichi Kohama

Yoshiharu Hino

Hiroto Watanabe

Yoshinori Aoshima

Osamu Nakayama

Kaname Tamada

Kyoichi Kohama

Osamu Shiratsuchi

Yusuke Hirai

An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.

Non-contact IC module

A contactless communication system information carrier which is high in handleability and yield but low in cost is provided. It includes a core piecein which an IC chipwith an antenna coilintegrally formed on one surface is fitted inside a recessof a core piece body, a non-metal spacerin which the core pieceis fitted to a fitting partlocated in a center of the spacerto retain the core pieceand a metal weightplaced and coupled so as to surround an outer periphery of the spacer. The antenna coiland the metal weightare separated from each other via the spacer

Non-contact communication system information carrier

A semiconductor device includes first and second antenna connection electrodes placed on the periphery of a semiconductor chip, an on-chip antenna connection electrode placed in the inner area of the semiconductor chip compared to the first and second antenna connection electrodes, and an internal circuit formed in the semiconductor chip. The first and second antenna connection electrodes are connected to the internal circuit by internal lines. The on-chip antenna connection electrode is connected to the internal circuit and the second antenna connection electrode by internal lines. An on-chip antenna is connected to the second antenna connection electrode and the on-chip antenna connection electrode. An external antenna is connected to the first and second antenna connection electrodes.

Semiconductor device having antenna connection electrodes

A small electronic device has a battery level detection unit for real-time detection of the current battery level and a communication unit for transmitting report data on a detected battery level to another small electronic device, such as a pocket PC device. The receiving small electronic device compares the data with data on its own battery level detected therein and displays the lower battery level data.

Small electronic device having battery level detection unit

The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chipand a coilconnected to the IC chip are embedded in a substratecomposed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.

Information carrier and process for production thereof

The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chip and a coil connected to the IC chip are embedded in a substrate composed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.

There is a flexible IC module utilizable for the production of contactless IC cards and a method for producing an information carrier using the flexible IC module. An IC chip and a coil are embedded in a flexible substrate comprising a nonwoven fabric or the like having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property. This flexible IC module is produced in the following procedure. {circle around (1)} A first nonwoven fabric having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property is placed on a bottom force . {circle around (2)} An IC chip and a coil are placed on the first nonwoven fabric after positioning them. {circle around (3)} A second nonwoven fabric is superposed on the IC chip and coil. {circle around (4)} A top force is pressed onto the second nonwoven fabric, and the first and second nonwoven fabrics, the IC chip and the coil are integrated by hot pressing.

Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module

The present invention is intended to provide an information carrier which has flat surfaces, is excellent in beautiful appearance, and permits necessary printing thereon after the production of the carrier, and a process for producing such a thin information carrier easily in high yield. The substrate 3 of the information storage carrier is composed of a material obtained by infiltrating a resin 8 into a reinforcer 7 made of a sheet-like material deformable in the direction of the thickness. An IC module 1 and a coil 2 are embedded in indents 34 formed by compressing the reinforcer 7 in the direction of the thickness, to smoothen both right and reverse sides of the substrate 3. Cover sheets 4 and 5 are attached to the right and reverse sides, respectively, of the substrate 3 with a bonding layer 6 to obtain the required information storage carrier. The substrate 3 having smooth right and reverse sides can be produced by placing the IC module 1 and the coil 2 on the aforesaid reinforcer impregnated with the resin and pressing the IC module 1 and the coil 2 until the surface of the resin layer and the surfaces of the IC module 1 and the coil 2 are placed on the same plane.

Growing community of inventors

Ibaraki, Japan

Kazuhiko Daido