Towa Corporation

Japan Fine Ceramics Center

Kazuhiko Bandoh

Michio Osada

Satoshi Kitaoka

Keiji Maeda

Takaki Kuno

Naoki Kawashima

Yoshinori Noguchi

Tsuyoshi Amakawa

Kouichi Kawamura

Fumio Takashima

Yoshihiko Kojima

A resin mold material includes one-dimensional communicating holes extending substantially linearly from a mold surface and having diameters from 1 nm to less than 10 &#x3bc;m; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface layer; and three-dimensional communicating holes communicating with the one-dimensional communicating holes in the support layer and having diameters larger than those of the one-dimensional communicating holes. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing a contact area of the mold surface and the liquid resin, i.e., the mold surface is repellant to the liquid resin. Gas in a mold cavity bounded by the mold surface is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, a release property of a molded product from the mold surface is improved and generation of voids is suppressed.

Resin mold material and resin mold

A method of processing a leadframe involves steps of transporting a leadframe to load it into a lead processing unit including plural sets of processing presses; adjusting a press pitch of the processing presses according to a work pitch of workpieces on the leadframe by rotating a nut member that is coupled to at least one of the processing presses and engaged on a non-rotating screw shaft extending in the transport direction of the leadframe, so that the nut member moves along the screw shaft and the respective processing press coupled thereto moves with the nut member; and performing a predetermined lead processing on the leadframe using the processing presses after the step of adjusting the press pitch.

Method for processing leadframe

A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the molding apparatus, so that the number of the molding units can be arbitrarily adjusted. In this manner, the method and apparatus can be easily reconfigured or rearranged to be adapted to mass production or small production runs of the same or different types of molded parts. By simultaneously carrying out various process steps, the overall process time is reduced.

Apparatus for molding resin to seal electronic parts

Method of molding resin to seal electronic parts

Growing community of inventors

Kyoto, Japan

Kazuhiko Bandoh