Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Kazuhide Uriu

Toru Yamada

Toshio Ishizaki

Tsutomu Matsumura

Hiroyuki Nakamura

Tomoyuki Iwasaki

Hideaki Nakakubo

Akira Minegishi

Masahiro Yamaoka

Kohei Masuda

Ryo Fukuda

Keiji Onishi

Masaya Sumita

Osamu Shibata

Hiroshi Kagata

Yasuhiro Sugaya

Eiji Takahashi

Masaharu Tanaka

Hidenori Katsumura

Susumu Sawada

Naoki Komatsu

Takashi Yui

Kouji Kawakita

Kiyomi Hagihara

Shinya Tokunaga

Tomohiro Kinoshita

Masakazu Adachi

Koichi Seko

Shouichi Kobayashi

Hiroyoshi Yoshida

Plug for optic and electrical hybrid connector

Receptacle for optic and electrical hybrid connector

A semiconductor device includes a metal plate capacitor that includes a heat-resistant metal plate and a capacitor unit including a sintered dielectric formed on at least one surface of the heat-resistant metal plate, a semiconductor chip disposed on the metal plate capacitor, a connector configured to electrically connect the semiconductor chip and the metal plate capacitor, and a protector configured to protect the semiconductor chip, the metal plate capacitor, and the connector.

Semiconductor device, package, and vehicle

A semiconductor device comprises a first semiconductor chip; and a second semiconductor chip provided on the first semiconductor chip with having chip-on-chip connection to the first semiconductor chip, wherein when seen from a direction perpendicular to an upper surface of the second semiconductor chip, an outline of the second semiconductor chip is larger than an outline of the first semiconductor chip, a plurality of electrode terminals for the first semiconductor chip are provided on an upper surface of the first semiconductor chip, the plurality of electrode terminals for the first semiconductor chip comprise one or more first covered terminals which are covered with the second semiconductor chip and one or more first uncovered terminals which are not covered with the second semiconductor chip.

Semiconductor device

A semiconductor device includes a first extended semiconductor chip including a first semiconductor chip and an extension extending outwardly from a side surface of the first semiconductor chip. The semiconductor device also includes a second semiconductor chip mounted above the first extended semiconductor chip and electrically connected with the first semiconductor chip. The first extended semiconductor chip includes a first extension electrode pad provided above the extension and electrically connected with an electrode of the first semiconductor chip.

Semiconductor device comprising an extended semiconductor chip having an extension

In an interposer substrate, a plating stub conductor and a ground conductor form a capacitor, and a plating stub conductor and the ground conductor form a capacitor. Capacitances of the capacitors are adjusted so that a phase difference between signals transmitted by a differential transmission using a signal line including a connection wiring conductor and a signal line including a connection wiring conductor is equal to 180 degrees.

Interposer substrate including capacitor for adjusting phase of signal transmitted in same interposer substrate

A circuit board analyzer includes a storage unit for storing mesh position information on an analyzed mesh-division model and extracted circuit constants in relation to each other; a division-model configuration unit for dividing the layout of a circuit board into meshes to configure a new mesh-division model; an identical-mesh determination unit for making a comparison between mesh position information on the new mesh-division model and mesh position information on the analyzed mesh-division model to determine identical meshes that have identical mesh position information; and a circuit-constant extraction unit for performing analytical processing based on the new mesh-division model to extract new circuit constants and reusing, as a new circuit constant associated with the identical meshes, an extracted circuit constant that is related to the mesh position information on the identical meshes.

Circuit board analyzer and analysis method

A circuit board analyzing method and a circuit board analyzer are provided which can greatly reduce analyzing time. The circuit board analyzer includes a computing unit, a memory unitconnected to the computing unit, and an input unitconnected to the computing unit. The computing unitincludes a wiring data acquiring sectionacquiring data of wirings formed on a circuit board, a basic circuit diagram forming sectiondividing the wirings into meshes and setting cells and branches connecting the adjacent cells, and an interference analysis setting sectionsetting an element ignoring range of elements set in the cells and the branches.

Analyzing device for circuit device, circuit device analyzing method, analyzing program, and electronic medium

In a differential transmission line, a substrate has first and second surfaces parallel to each other, and a first grounding conductor is formed on the second surface of the substrate. A dielectric layer is formed on the first grounding conductor, and a second grounding conductor is formed on the dielectric layer. First and the second signal conductors are formed to be parallel to each other on the first surface of the substrate. The first signal conductor and the first and second grounding conductors constitute a first transmission line, and the second signal conductor and the first and second grounding conductors constitute a second transmission line. A slot is formed in the first grounding conductor to three-dimensionally intersect with the first and second signal conductors and to be orthogonal to a longitudinal direction thereof, and a connecting conductor is formed for connecting the first grounding conductor with the second grounding conductor.

Parallel differential transmission lines having an opposing grounding conductor separated into two parts by a slot therein

For example, in a conventional high frequency switch used for a mobile phone and so on, high frequency distortion is caused by a diode which is turned off upon transmission. A high frequency switch includes a switch circuit for switching transmission and reception performed via a transmitting terminal and receiving terminals, said switch circuit having a diode turned off upon transmission, and a low-pass filter for suppressing high frequency distortion caused by the diode upon transmission.

High frequency switch, radio communication apparatus, and high frequency switching method

A 3-frequency branching circuit in the past could not be used for a system wherein a TDMA method such as GSM and DCS and a W-CDMA method such as UMTS are mixed. The 3-frequency branching circuit equipped with branching means having first and second internal terminals, an antenna terminal of connecting to an antenna, a low-pass filter connected between the first internal terminal and the antenna terminal, and a high-pass filter connected between the second internal terminal and the antenna terminal, a switching circuit of switching between GSM TX and GSM RX, a switching circuit of switching between DCS TX, DCS RX and a third internal terminal, and a duplexer connected to the third internal terminal.

3-frequency branching circuit, branching circuit and radio communication equipment

A high frequency switch having a plurality of signal paths for four frequency bands, the high frequency switch, has

High frequency switch and high frequency radio communication apparatus

A high-frequency switch has a first transmission-reception switching circuit for selectively switching between the signal transfer between an antenna terminal and a first transmitting-circuit terminal and the signal transfer between the antenna terminal and a first receiving-circuit terminal; a second transmission-reception switching circuit for selectively switching between the signal transfer between the antenna terminal and a second transmitting-circuit terminal and the signal transfer between the antenna terminal and a second receiving-circuit terminal; a first diplexer disposed between the antenna terminal and the first transmission-reception switching circuit and between the antenna terminal and the second transmission-reception switching circuit; and a second diplexer connected to the second receiving-circuit terminal to selectively switch the signal transfer between the second receiving-circuit terminal and a third receiving-circuit terminal and the signal transfer between the second receiving-circuit terminal and a fourth receiving-circuit terminal by using a phase-shifting circuit and a surface-acoustic-wave filter.

High-frequency switch, laminated high-frequency switch, high-frequency radio unit, and high-frequency switching method

To realize high pressure-tightness and improvement in a high-frequency characteristic due to a low impedance between a shunt FET and a ground of a FET switch circuit. An antenna switch module comprising a switch circuit for switching between transmitting and receiving of a signal between an antenna and a transmitting portion and/or a receiving portion and having a shunt circuit, wherein a capacitor of the shunt circuit of the switch circuit is provided to a dielectric layered body, and remaining elements of the switch circuit are provided to semiconductor chips mounted on the dielectric layered body.

Antenna switch module, all-in-one communication module, communication apparatus and method for manufacturing antenna switch module

A diplexer capable of passing signals of a high frequency band without being attenuated over a wide frequency band, and a high-frequency switch using the diplexer are provided. The diplexer includes a low-pass filterhaving a parallel resonant circuit formed by a first capacitor Cand a first inductor Land a serial resonant circuit formed by a second capacitor Cand a second inductor LWith this structure, two attenuation poles are provided in the low-pass filterThus, a passband of a high-pass filtercan be widened.

Growing community of inventors

Osaka, Japan

Kazuhide Uriu