Matsushita Electric Industrial Co., Ltd.

Kazuhide Isaji

Hidehiko Karasaki

Hisashi Kinoshita

Makoto Kato

Tsutomu Yano

Katsuichi Ukita

Hideaki Nagatoshi

A laser processes a circuit board including at least two layers. The two layers are a conductive layer with a plurality of holes and an insulating layer. The conductive layer is disposed on a surface layer of the insulating layer which is to be processed by applying a laser beam to portions of the insulating layer corresponding to the holes of the conductive layer. The circuit board is irradiated with the laser beam, and a reflected laser beam is detected, whereby the laser processing of the insulating layer corresponding to an abnormal hole in the conductive layer is stopped, if the detected value of the reflected laser beam is an abnormal value differing from a desired value. Also, the insulating layer corresponding to the hole is processed when the detected value of the reflected light conforms to the desired value.

Laser processing method and equipment for printed circuit board

This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining. For this purpose, the number of laser pulse outputs capable of machining securely is preset. During laser machining, reflected laser beam intensity from the workpiece and incident laser beam intensity are detected, and the machining state of the workpiece is detected. As a result, when judging the workpiece has reached a desired machining state, laser machining is finished if the number of times of laser machining has not reached the set number of laser pulse outputs. If it is judged that the workpiece has not reached the desired machining state, laser machining is finished when reaching the set number of laser pulse outputs. As a result, the laser machining method and laser machining apparatus capable of drilling holes of high quality at high yield and shortening the machining cycle time can be realized.

Laser machining method, laser machining apparatus, and its control method

Laser machining method, laser machining device and control method of laser machining

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Osaka, Japan

Kazuhide Isaji