Matsushita Electric Industrial Co., Ltd.

Kazue Okanoue

Toshinori Mimura

Hiroaki Onishi

Masahiro Taniguchi

Nobuya Matsumura

Ken Takahashi

Toshiaki Yamauchi

Takao Naito

Kazumi Ishimoto

Youichi Nakamura

Kurayasu Hamasaki

Osamu Hikita

Syoji Sato

Koji Mitsushiro

A main wiping portion which contacts the back of a mask through a cleaning paper is provided behind a suction port as viewed in the direction of movement of an air suction portion. The cleaning paper is able to wipe off both solder paste adhered on the back of the mask and solder paste discharged from openings of the mask by suction through the suction port, whereby the solder paste deposits on the mask can be cleaned off at high removal efficiency.

Printing mask cleaning apparatus and method

In a printing apparatus and method, printing material is printed on to-be-printed circuit boards in a predetermined pattern and a printing state of the material is inspected. The apparatus includes the following devices. A board supporting device has a rotary body supporting a plurality of board-fixed tables to which the boards are secured, and turns the rotary body together with the board-fixed tables intermittently at predetermined angular intervals so as to stop the board-fixed tables at each of a fixing, recognizing, printing, and inspecting position. A board feed device feeds the boards to the board-fixed tables arranged at the fixing position. A board discharge device discharges the boards from the board-fixed tables arranged at the fixing position. A recognizing device recognizes fixed positions of the boards relative to the board-fixed tables at the recognizing position. A printing device prints the printing material on the boards at the printing position. An inspecting device inspects the printing state of the boards at the inspecting position. The method carries out the board-feeding, position recognizing, printing, printing-state-inspecting, and board-discharging operations by use of the corresponding devices.

Printing apparatus and method for inspecting printed materials

An apparatus for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee. The apparatus includes a device for moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and a controller for changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.

Apparatus for printing solder paste to a printed circuit board and

A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.

Method for printing solder paste

Growing community of inventors

Kadoma, Japan

Kazue Okanoue