Sony Computer Entertainment Inc.

Sony Corporation

International Business Machines Corporation

Kabushiki Kaisha Toshiba

Other

Kazuaki Yazawa

Iwao Takiguchi

Tetsuji Tamura

Avram Bar-Cohen

Atsuhiko Imai

Kenichi Adachi

Charles Ray Johns

Michael Fan Wang

Yuichi Ishida

Hiroki Kihara

Munehiro Yoshida

Mitsuo Hashimoto

Hiroyuki Ryoson

Daniel Lawrence Stasiak

Norikazu Nakayama

Toshiyuki Hiroi

Hidetoshi Kusano

Takashi Omizo

Melia F Gordon

According to an embodiment, there is provided a heat spreader including a condenser portion formed of a nanomaterial. The heat spreader further includes a first plate member, a second plate member, and a support portion. The first plate member includes a first surface, the first surface including a first area provided with the condenser portion. The second plate member includes a second surface and is arranged such that the second surface faces the first surface. The support portion protrudes from the first area of the first plate member to the second plate member, and has an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member.

Heat spreader, electronic apparatus, and heat spreader manufacturing method

According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being arranged apart from and higher than the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion by a gravitational force.

An electromotive cooling head includes a substrate, an N-pole magnet, and an S-pole magnet, and kept in intimate contact with the backside of the semiconductor integrated circuit so as to cover it. The substrate has a fluid channel having a micro-channel structure, through which a conductive fluid flows. An anode and a cathode are disposed to sandwich the fluid channel. The conductive fluid interacts with a magnetic field to thereby induce an electromotive force between the anode and the cathode. A circuit includes, on its backside, a power supply voltage terminal and a ground terminal, and is driven by the electromotive force induced in the electromotive cooling head.

Power supply system employing conductive fluid

This task management method includes dividing a unit time of processing into a reserved band for guaranteeing real-timeness and a non-reserved band not for guaranteeing real-timeness, and skipping a task to be executed in the non-reserved band as appropriate when processor throughput falls. That is, when the operating frequency of the processor is lowered in order to suppress heat generation, the real-timeness of tasks to be executed in the reserved band is guaranteed at the expense of processing the task to be executed in the non-reserved band in a best-efforts fashion.

Skipping non-time-critical task according to control table when operating frequency falls

Disclosed is a light-emitting device. The light-emitting device includes an EL layer and a heat dissipation layer. The EL layer includes a first semiconductor layer, a second semiconductor layer, and an active layer, the first semiconductor layer having a first conductivity type that is one of n type and p type, the second semiconductor layer having a second conductivity type that is opposite to the first conductivity type, the active layer being provided between the first semiconductor layer and the second semiconductor layer. The heat dissipation layer has the first conductivity type and is bonded to a side of the EL layer closer to the second semiconductor layer than the first semiconductor layer.

Light-emitting device, electronic apparatus, and light-emitting device manufacturing method

A heat control apparatus for a circuit includes: a heat detecting unit which acquires the heat generation condition of a semiconductor integrated circuit from an inspection image obtained by capturing an image of the semiconductor integrated circuit by an image capturing sensor; and a cooling control unit which controls a cooling means for cooling the semiconductor integrated circuit in accordance with the acquired heat generation condition.

Method, device and system for controlling heating circuits

A heat generation amount estimation unit acquires the number of sub processors currently in operation, acquires the current operating frequency, and estimates the amount of heat generation after a period &#x394;t. A temperature control unit estimates the temperature after the period &#x394;t based on the current temperature input from a temperature sensor and the amount of heat generation estimated, and compares it with a predetermined threshold temperature. If the predetermined threshold temperature is reached, the temperature control unit acquires the number of sub processors available in parallel after the period &#x394;t from a task management unit, and consults a performance table to determine which operation point to shift to. A sub processor control unit and a frequency control unit switch to the number of sub processors in operation and the operating frequency accordingly. The performance table lists possible operation points in order of performance.

Processor for controlling performance in accordance with a chip temperature, information processing apparatus, and method of controlling processor

A semiconductor chipis mounted on a package substratewith its circuit side facing to a board. Heat is dissipated from an upper side of the semiconductor chipopposite to the circuit side. A sealing resinseals around the periphery of the semiconductor chipso that the upper side of the semiconductor chipis exposed to atmosphere. A fixing memberis buried in the sealing resinso that a hookformed on the tip of the fixing memberextends above the upper side of the semiconductor chip. A spreaderdissipates heat emitted from the semiconductor chip. A guiding slotis formed on the side facing to the package substrateof the spreader. The hooksof the fixing membersare inserted into the guiding slotsrespectively, and then the spreaderis rotated by predetermined angle against the package substrate. Then, the hookstravel along the slots. Through such process, the spreaderis pulled to come into contact with the upper side of the semiconductor chip

Semiconductor package involving a rotary lock that connects a package substrate and a separate component

A semiconductor device includes a substrate, a semiconductor chip flip-chip mounted on the substrate, a sealing resin layer sealing the surroundings of the semiconductor chip, and a heat sink bonded to the sealing resin layer through a TIM layer. In addition, a cooling medium is encapsulated in an enclosed space formed on the rear surface of the semiconductor chip.

Semiconductor device having high cooling efficiency and method for manufacturing the same

Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In one embodiment, an integrated circuit includes multiple, duplicate functional blocks. A separate thermal sensor is coupled to each of the duplicate functional blocks, preferably in the same relative location on each of the duplicate functional blocks, and preferably at a hotspot. One embodiment also includes thermal sensors on one or more functional blocks of other types in the integrated circuit. One embodiment includes a thermal sensor positioned at a cool spot, such as at the edge of the integrated circuit chip. Each of the thermal sensors may have ports to enable power and ground connections or data connections between the sensors and external components or devices.

Systems and methods for thermal sensing

A temperature sensor measures a temperature of a certain location inside a processor. An overall heat amount measurement unit measures the overall amount of heat of the processor. A temperature estimation unit estimates the temperatures of a plurality of hot spots occurring in the processor based on the temperature of the certain location detected by the temperature sensor, and determines the maximum temperature of the processor. The temperature estimation unit switches between maximum load temperature estimation coefficients and individual load temperature estimation coefficients stored in a storing unit for reference, depending on the overall amount of heat of the processor, and applies them to a temperature estimation function(s) for converting the sensor temperature into the temperatures of the hot spots. An operating frequency control unit exercises control for lowering the operating frequency of the processor when the maximum temperature of the processor estimated by the temperature estimation unit exceeds a predetermined limit temperature.

Processor, processor system, temperature estimation device, information processing device, and temperature estimation method

An electronic device includes a cooling apparatus having: a primary cooling unit which is disposed in close proximity with an electronic device so as to face a surface thereof; an auxiliary cooling unit which is disposed in close proximity with the electronic device so as to face a surface thereof; and a controller which drives at least one of the primary cooling unit and the auxiliary cooling unit so as to cool the electronic device.

Electronic device cooling device and electronic device cooling method

A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the thermal distribution state detected. A nozzle selecting unit selects a cooling nozzle corresponding to the position. An emission time computing unit computes a coolant emission time and timing for the cooling nozzle. Upon reception of an instruction from the emission control unit, a drive unit drives a nozzle unit, thereby allowing a jet of coolant to impinge upon the electronic device.

Apparatus, method, and control program for cooling electronic devices

Systems and methods for sensing temperatures of multiple functional blocks within a digital device and controlling the operation of these functional blocks in a manner that selectively reduces temperatures associated with some of the functional blocks, but not others. One embodiment comprises an integrated circuit having multiple functional blocks (such as processor cores) and a set of thermal sensors coupled to sense the temperatures of the functional blocks. The integrated circuit includes control circuitry configured to receive signals from the thermal sensors, detect thermal events in the functional blocks and to individually adjust operation of the functional blocks to reduce the temperatures causing the thermal events. In one embodiment, the control circuitry includes a detection/control circuit coupled to each of the functional blocks and a thermal management unit configured to evaluate detected thermal events and to determine actions to be taken in response to the thermal events.

Systems and methods for thermal management

A heat dissipating member has an inner wall, outer wall, and partition walls. The inner wall directly or indirectly receives heat transfer from the heat source. The outer wall opposes the inner wall at a distance. The partition walls connect the inner wall and the outer wall. The inner wall, the outer wall, and the partition walls define a plurality of through-holes along the inner wall and the outer wall. Each of the through-holes extends in a vertical direction within a tilt range in which gravitational influence is utilizable. Upper and lower ends of each of the through-holes open to the outside. Generated heat from the heat source is propagated to the outer wall via the inner wall and the partition walls. A predetermined amount of heat generated by the heat source passing through the outer side of the outer wall is determined so that rise in temperature of the outer side relative to the ambient temperature can be kept under a predetermined value.

Growing community of inventors

Chiba, Japan

Kazuaki Yazawa