Denso Corporation

Nippon Soken, Inc.

Kazuaki Watanabe

Makiko Sugiura

Yasuyuki Okuda

Takahiko Yoshida

Tetsuo Yoshioka

Hisanaga Matsuoka

Noboru Endoh

An ultrasonic sensor includes an ultrasonic detecting element, an acoustic matching member, and an oscillation damping member. The ultrasonic detecting element detects an ultrasonic wave. The acoustic matching member has a receiving surface that is adapted on a side of the certain object to be exposed to a space, in which the detected body exists. The receiving surface receives the ultrasonic wave reflected by the detected body. The acoustic matching member is made of a material having an acoustic impedance larger than that of air and smaller than that of the ultrasonic detecting element. The oscillation damping member is disposed between an attachment portion and the acoustic matching member. The attachment portion is adapted for attaching the ultrasonic sensor to the certain object. The oscillation damping member damps transmission of oscillation from the certain object to the acoustic matching member.

Ultrasonic sensor

An ultrasonic sensor includes a resin substrate and an ultrasonic oscillator. The ultrasonic oscillator is provided approximately at the center of a component side of the resin substrate and generates and detects an ultrasonic wave. The resin substrate is made of, for example, a polycarbonate resin, i.e., the same material as a car bumper, and is shaped into a flat plate. The component side of the resin substrate is provided with a padadjacent to the ultrasonic oscillator. The pad is used for metal wiring based on wire bonding. The pad is made of a hard metal material excellent in conductivity and heat resistance such as stainless steel, and Al or Al alloy, for example. The resin substrate is formed as a single piece through insert molding by pouring a melted resin. Through this process, the pad is provided for the component side of the resin substrate.

Resin substrate and ultrasonic sensor using the same

An ultrasonic sensor composed of a substrate and a piezoelectric vibrator mounted on the substrate is advantageously used as a sensor for detecting a distance to an object located in front of an automotive vehicle. Ultrasonic waves transmitted from the sensor are reflected by the object, and the reflected waves are received by the sensor. Based on the reflected waves, the distance from the vehicle to the object is calculated. To reduce rigidity and thereby to lower a resonant frequency of the substrate to a desirable level, grooves are formed in the substrate. A thickness of the substrate is not reduced to maintain its mechanical strength against an impact force. A resonant frequency which is desirable to realize a sufficiently high directivity and sensitivity is obtained in this manner without enlarging a size of the ultrasonic sensor.

Ultrasonic sensor having vibrator mounted on substrate

An ultrasonic sensor includes an ultrasonic detector for detecting an ultrasonic wave, an acoustic matching member joined to the ultrasonic detector, a housing in which the ultrasonic detector and the acoustic matching member are accommodated, a vibration isolator located between the acoustic matching member and an inner side wall of the housing to damp an unwanted vibration from outside, and a cushion member located between the ultrasonic detector and an inner bottom wall of the housing to absorb external force applied to the ultrasonic sensor The cushion member is not in contact with the acoustic matching member.

An ultrasonic sensor for detecting an ultrasonic wave, which is output from an ultrasonic generator and reflected by an object to be detected, the ultrasonic sensor includes: an acoustic matching layer having a first surface and a second surface, the first surface which receives the ultrasonic wave, and the second surface which is opposite to the first surface; and an ultrasonic detection element including a vibration member. The vibration member is coupled with the second surface of the acoustic matching layer. The acoustic matching layer is repeatedly deformable in accordance with a standing wave, which is generated in the acoustic matching layer by the received ultrasonic wave. The vibration member resonates with the repeat deformation of the acoustic matching layer.

An infrared sensor includes a base plate having a membrane portion at the center thereof an a thick portion around the membrane, a thermocouple unit having a hot side contact member formed on the membrane portion and a cool side contact member formed on the thick portion, a heater formed near the thermocouple unit, a hot side thermo-sensitive resistor formed on the membrane portion and a cool side thermo-sensitive resistor formed on the thick portion. The heater, the hot side thermo-sensitive resistor and the cool side thermo-sensitive resistor are made of the same material as the hot side contact or the cool side contact. Therefore, additional manufacturing step is not necessary to form the heater and the resistors.

Infrared sensor having thermo couple

An ultrasonic sensor for detecting a position and/or a shape of an object located around an automotive vehicle is mounted on a structure of the vehicle such as a bumper. The ultrasonic sensor includes a receiving member for receiving ultrasonic waves reflected on the object to be detected and receiving element having plural vibrating portions. The receiving member is sectioned by intercepting slits into plural receiving regions each corresponding to each vibrating portion. The intercepting slit eliminates or suppresses crosstalk between neighboring receiving regions, and thereby reducing detection noises due to the crosstalk and improving detection sensitivity of the ultrasonic sensor. The shape of the intercepting slit is made to satisfy the formula: 0.35&#x2266;L/T&#x2266;0.60, where L is a depth of the slit and T is a thickness of the receiving member. In this manner, the crosstalk resulting in detection noises is sufficiently suppressed.

Ultrasonic sensor for use in automotive vehicle

An infrared sensor device includes an infrared sensor element in which a membrane is formed on a surface side of a substrate by forming a concave portion on a rear face side of the substrate, and electrodes for detection are arranged on the surface side of the substrate, and an infrared ray absorbing film for absorbing the energy of an infrared ray by receiving the infrared ray is arranged at the membrane on the rear face side of said substrate. The substrate is electrically connected to a circuit substrate through a bump in a state in which the surface side of the substrate is opposed to the circuit substrate.

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Nagoya, Japan

Kazuaki Watanabe