Sharp Kabushiki Kaisha Corporation

Kazuaki Tatsumi

Yoshiki Sota

Hiroyuki Nakanishi

Koji Miyata

Masahiro Okita

Masato Yokobayashi

A wiring board () of the present invention includes: a through hole (), provided in a semiconductor chip mounted region (), penetrating the wiring board (); and a groove pattern (), provided on a solder resist () formed on the semiconductor chip mounted region (), leading to the through hole (). The foregoing configuration makes it possible to guide, via the groove pattern () to the through hole (), moisture that collects in the semiconductor chip mounted region () and therefore to effectively discharge the moisture from the semiconductor chip mounted region (). Thus, a semiconductor device () that employs the wiring board () does not suffer from vaporization and expansion, inside of it, due to heat that is applied at the time of manufacturing the semiconductor device () and at the time of mounting the semiconductor device () on a mount substrate. It is therefore possible to reduce expansion of the semiconductor device.

Wiring board, semiconductor device and method for manufacturing semiconductor device

Patterns provided on a surface of a substrate include an adhesion area pattern and one or more non-adhesion area patterns. A chip electrode on a backside of a semiconductor chip is attached to the adhesion area pattern by a conductive adhesive. Consequently, an area of patterns subjected to gold plating that is stable in a steady state is smaller in a substrate of the present invention than in a conventional substrate, resulting in reduction in costs. Further, the chip electrode is attached to the adhesion area pattern by a conductive adhesive in a liquid form. Consequently, a semiconductor device of the present invention allows reducing use of an expensive conductive adhesive compared with a conventional semiconductor device, resulting in reduction in costs.

Growing community of inventors

Osaka, Japan

Kazuaki Tatsumi