Shin-Etsu Chemical Co., Ltd.

Shin-Etsu Chemical C O., Ltd.

Shin-Estu Chemical Co., Ltd.

Kazuaki Sumita

Toshio Shiobara

Naoyuki Kushihara

Miyuki Wakao

Kimitaka Kumagae

Kaoru Katoh

Kazunori Kondo

Yoshihiro Tsutsumi

Yoichiro Ichioka

Yoshihira Hamamoto

Yuki Kudo

Tomoaki Nakamura

Tatsuya Kanamaru

Kenji Hagiwara

Haruyoshi Kuwabara

Masatoshi Asano

Yoshinori Takamatsu

Shingo Ando

Shuichi Fujii

Kunio Ito

Masahiro Kaneta

Tokue Kojima

Haruyoshi Kuwabawa

Tatsuya Uehara

Taro Shimoda

Akira Yajima

The present invention is a method for producing a power module, including processes (1) to (4) in the following order: (1) a disposition process of disposing a thermosetting resin composition that is solid at 25° C. into a container housing an insulator substrate with multiple semiconductor components mounted thereon; (2) a melt process involving disposing the container having the thermosetting resin composition disposed therein into a molding apparatus capable of heating, pressurization, and depressurization, and heating the container to melt the thermosetting resin composition; (3) a pressurization-depressurization process of performing one or more depressurizations and one or more pressurizations inside the molding apparatus; and (4) a cure process of heating the inside of the molding apparatus to cure the thermosetting resin composition. This is to provide a method for producing a power module having few voids at the time of molding and excellent reliability.

Method for producing power module, and power module

Provided are a thermally conductive resin sheet having light transmission, including a cured product of a fiber cloth-containing thermally conductive resin composition prepared by thermally curing or semi-curing a laminate composed of five or more sheets of a prepreg made by impregnating a fiber cloth made of thermally conductive fibers as warp and white or transparent fibers as weft with a transparent curable resin composition, the cured product having a cut surface vertical to a length direction of the thermally conductive fibers, and a method for producing the thermally conductive resin sheet.

Thermally conductive resin sheet having light transmission and method for producing the same

Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains:

Heat-curable resin composition, heat-curable resin film and semiconductor device

The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) a phenolic curing agent; and (D) a curing accelerator, wherein 'A' represents a single bond or a divalent organic group selected from the following formulae.  This provides a resin composition with improved strength and excellent adhesion and flexibility, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device

Provided is a heat-curable resin composition having an excellent workability, and capable of yielding a cured product having both a heat resistance and a low water-absorption property. The heat-curable resin composition contains:

Heat-curable resin composition

The present invention is a thermosetting epoxy resin sheet for encapsulating a semiconductor, characterized by being a sheet formed from a composition including: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25&#xb0; C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in a molecule thereof, (D) an inorganic filler, and (E) an urea-based curing accelerator. The present invention provides a thermosetting epoxy resin sheet for encapsulating a semiconductor that has excellent flexibility and good handleability in an uncured state, together with excellent storage stability and formability.

Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same

The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein 'A' represents a single bond or a divalent organic group selected from the following formulae.  This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

Provided is a versatile heat-curable resin composition for semiconductor encapsulation that has a favorable water resistance and abradability, and exhibits a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-size wafer. The heat-curable resin composition of the invention contains:

Heat-curable resin composition for semiconductor encapsulation

Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer. The heat-curable resin composition for semiconductor encapsulation comprises:

Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175&#xb0; C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

Method for encapsulating large-area semiconductor element-mounted base material

The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 &#x3bc;m as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance.

Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device

The present invention can provide a heat-curable resin composition which is excellent in insulation property, heat resistance, and preservation stability. The heat-curable resin composition includes (A) cyanate ester compound having at least two cyanate groups in a molecule, (B) phenol curing agent including a resorcinol type phenol resin represented by the formula (1), (In the formula, n represents an integer from 0 to 10, each of Rand Rindependently represents a monovalent group selected from a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an allyl group, and a vinyl group.), and (C) at least one compound selected from a tetraphenylborate of a tetra-substituted phosphonium compound and a tetraphenylborate represented by the formula (2). (In the formula, Rrepresents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and n represents an integer from 1 to 3).

Set of compositions for preparing system-in-package type semiconductor device. The composition set consists of underfill composition for preparing underfill part and encapsulation resin composition for preparing resin encapsulation part. 1) A cured product of the underfill composition has a glass transition temperature, Tg, &#x2267;100&#xb0; C. and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by &#x2266;20&#xb0; C. 2) Total linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg&#x2212;30)&#xb0; C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg&#x2212;30)&#xb0; C. is &#x2266;42 ppm/&#xb0; C. 3) A ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.

Set of resin compositions for preparing system-in-package type semiconductor device

A composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler having an average particle size of 0.1-10 &#x3bc;m and a maximum particle size of up to 75 &#x3bc;m, and (D) a surface-silylated silica having an average particle size of 0.005 &#x3bc;m to less than 0.1 &#x3bc;m is suited as a dam composition for use with a underfill material in the fabrication of multilayer semiconductor packages.

Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same

A liquid epoxy resin composition comprising: (A) a liquid epoxy resin; (B) an amine type curing agent; (C) a sulfur-containing phenol compound in an amount of from 1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B); and (D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).

Growing community of inventors

Annaka, Japan

Kazuaki Sumita