Ube Industries, Inc.

High Man Parts Corp. Ltd.

Marcon Electronics Corp. Ltd.

Kazuaki Nishio

Tsunetomo Nakano

Hiroshi Yasuno

Kohei Nakajima

Hiroshi Watanabe

Toshikazu Hayashi

Hiroshi Shimada

Kiyoshi Sakamoto

Toshio Maruyama

Hiroshi Andou

Kumiko Narisawa

An electrolytic capacitor having very thin spacer layers is produced by a process in which at least two of the surfaces of an anode valve action metal foil and a cathode metal foil are coated with a photosensitive polymer resin solution; the resultant photosensitive polymer resin solution layers are solidified; the solidified photosensitive polymer resin coatings are masked with a negative or positive masking film having a desired pattern and irradiated with an actinic radiation to partly harden the photosensitive polymer resin coatings in accordance with the masking pattern; after removing the masking film, the irradiated photosensitive polymer resin coatings are developed with a developing liquid to provide spacer layers consisting of hardened portions of the photosensitive polymer resin coatings; the anode and cathode metal foils having the spacer layers are superposed on each other in such a manner that at least one spacer layer is located between the superposed anode and cathode metal foils and at least one other spacer layer is located on at least one of the outside surfaces of the superposed anode and cathode metal foils, to provide a laminate; the laminate is wound into a capacitor element; and then the capacitor element is impregnated with an electrolyte.

Process for producing an electrolytic capacitor

A transparent aromatic polyimide produced by polymerization and imidation of an aromatic tetracarboxylic acid containing as a principal component biphenyltetracarboxylic acid and an aromatic diamine containing as a principal component bis(aminophenoxy-phenyl)sulfone of the formula (I) or bis(aminophenoxy-phenyl)propane of the formula (II): ##STR1##

Transparent aromatic polyimide

In a multilayer printed circuit board comprising an insulating substrate and a plurality of circuit elements provided thereon in layers, each of which is composed of a circuit pattern and an insulating resin layer provided over the circuit pattern, the circuit patterns arranged adjacently to each other being portionwise connected electrically through via at least one hole, the improvement in which said insulating resin layer comprises a photoset resin of an aromatic polyamide having at least 10 molar % of a constitutional unit of the formula (Ia): ##STR1## wherein each of R.sup.1 and R.sup.2 independently is a hydrogen atom or a residue of a reactive organic compound, Ar.sup.1 is a divalent aromatic residue, and Ar.sup.2 is a divalent aromatic residue possessing a photosensitive group.

Multilayer printed circuit board

An organic solvent-soluble photosensitive polyamide resin usable for producing photoset resin product having excellent heat resistance and electrical and mechanical properties, comprising a polycondensation product of an aromatic dicarboxylic acid component with an aromatic diamine component consisting of 10 to 100 molar % of a photosensitive diamine compound of the formula (I) and 10 to 90 molar % of a non-photosensitive diamine compound of the formula (II),

Organic solvent-soluble photosensitive polyamide resin

An organic solvent-soluble photosensitive polyimide resin having excellent heat resistance and electrical and mechanical properties, comprising a copolycondensation product of a biphenyltetracarboxylic acid component with an aromatic diamine component consisting of 40 to 90 molar % of a diamine compound of the formula (I) and 10 to 60 molar % of a diaminodiphenylether compound of the formula (II), ##STR1## wherein X=--CO--O-- or --CH.sub.2 --O--, R.sub.1 and R.sub.2 =an organic residue having an ethylenically unsaturated radical, and R.sub.3 =H or --NHCOR.sub.2.

Organic solvent-soluble photosensitive polyimide resin

A photosetting composition comprises an unsaturated acid-modified bisphenol type epoxy compound having an acryloyl radical; an oligoester diacrylate compound having a molecular weight of 420 or more; a photopolymerizable acrylate type monomeric compound having a molecular weight of 100 to 400; a bisphenol type epoxy resin having a softening point of 50.degree. C. to 150.degree. C. or a saturated acid-modified bisphenol type epoxy resin having a softening point of 50.degree. C. to 150.degree. C.; and a photopolymerization initiator, said composition having a proper viscosity and an excellent photocuring reaction rate and being able to form a photocured resinous film or article having a satisfactory Dupont impact strength, impact bending strength, and bonding property to metallic materials.

Photosetting composition containing modified epoxy resins and an

A photo-setting composition essentially consisting of: (A) 100 weight parts of a product prepared by esterifying a maleic anhydride adduct of a liquid polybutadiene with a hydroxyl compound; (B) 10 - 150 weight parts of one or more than one kind of unsaturated compound selected from the group consisting of a hydroxyl compound identified above, a di(meth)acrylate compound and a glycidyl monoester compound; and (C) 0.5 - 10 weight parts of a benzoinether compound.

Growing community of inventors

Ichihara, Japan

Kazuaki Nishio