Denso Corporation

Kazuaki Mawatari

Shinji Kawano

Minekazu Sakai

Mariko Fujieda

Masaaki Tanaka

Tomoya Jomori

Keigo Hikida

Kazuki Koda

Kazuya Hirasawa

Yoshihisa Banno

Hodaka Mori

Yutaka Hayakawa

Takahiro Higuchi

Sho Takano

Masaaki Inoguchi

Ryuta Ikoma

Yuji Koyama

A piezoelectric element includes a plurality of vibration regions that are separated from each other by a slit, and the slit is formed to have a tapered portion that is tapered from a first surface of the vibration regions on an opposite side to a support to a second surface opposite to the first surface. An electrode film is positioned inside than the slit when being viewed from a normal direction orthogonal to the first surface, and an angle formed by a side surface of the tapered portion in the vibration region and a surface parallel to the first surface is in a range of 39 to 81 degrees.

Piezoelectric element, piezoelectric device, and method of manufacturing piezoelectric element

A piezoelectric element includes a support member and a vibrating portion. The vibrating portion has a support region supported by the support member, and a plurality of vibration regions, one end portion side of which is supported by the support region, and the other end portion side of which is opposite to the one end portion is floating from the support member. A first vibration region in which a mass on the one end portion side is heavier than the mass on the other end portion side serves as a pressure detection section outputting a first detection signal based on the charge of the piezoelectric film. A second vibration region in which a mass on the other end portion side is heavier than the mass on one end portion side serves as an acceleration detection section outputting a second detection signal based on the charge of the piezoelectric film.

Piezoelectric element, piezoelectric device, and manufacturing method of piezoelectric element

A server including a storage and a controller is communicably connected with a communication terminal. The storage is configured to store a processing data and an analysis data for each of a plurality of analysis targets. The processing data relates to a processing condition for forming a concavo-convex structure on a detection substrate to be used in performing a spectroscopic analysis. The analysis data is used to analyze the analysis target from a spectroscopic spectrum of the analysis target obtained by the spectroscopy analysis. Upon receiving a signal requesting the processing data, the controller is configured to select the processing data corresponding to the analysis target and transmit the selected processing data to the communication terminal. Upon receiving a spectroscopic spectrum, the controller is configured to use the analysis data to analyze the spectroscopic spectrum.

Sensing system and storage medium storing data structure used in sensing system

A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

Semiconductor device and method for manufacturing same

A raindrop recognition device is configured to recognize a raindrop on a transparent panel. The raindrop recognition device includes a storage unit, an image input unit, and an image recognition unit. The storage unit stores a trained model that is a machine learning model trained using, as training data, images of the transparent panel with adhered raindrops and images of the transparent panel without adhered raindrops. Image data of the transparent panel taken by a camera is input to the input unit. The image recognition unit is configured to calculate a value representing a raindrop likeness of an object on the transparent panel in the image data by inputting the image data to the trained model. The trained model is trained by training data including images of the transparent panel with uniform background and images of the transparent panel with light source.

Raindrop recognition device, vehicular control apparatus, method of training model, and trained model

A semiconductor device includes a semiconductor element, an electronic component electrically connected to the semiconductor element, a connection member electrically connecting the electronic component to the semiconductor element, and a sealing resin portion having a first surface and a second surface opposite to the first surface and integrally holding the semiconductor element, the electronic component, and the connection member in a state where a semiconductor top surface as a surface of the semiconductor element and a component surface as a surface of the electronic component are exposed from the sealing resin portion on a side adjacent to the first surface.

Semiconductor device and method for producing the semiconductor device

A semiconductor device includes: a substrate; a semiconductor chip disposed adjacent to a front surface of the semiconductor substrate; an adhesive fixing a back surface of the semiconductor chip to the front surface of the substrate; and a plurality of spacers disposed to regulate a distance between the substrate and the semiconductor chip. The spacers are bonded to the front surface of the substrate or the back surface of the semiconductor chip, and are located on respective vertexes of a polygon surrounding a center of gravity of the semiconductor chip.

Semiconductor device

A bonded body includes a first metal piece, a second metal piece, and a spacer. The first metal piece has a first surface and a protrusion protruding on the first surface. The second metal piece has a second surface, and the second surface of the second metal piece is bonded to the first surface of the first metal piece at the protrusion. The spacer has an electrically insulating property. The spacer is provided on the first surface of the first metal piece, and located between the first metal piece and the second metal piece. The first metal piece and the second metal piece are arranged to face each other such that a portion of the first surface of the first metal piece outside of the spacer is exposed from the second metal piece.

Bonded body and method for manufacturing the same

A pressure sensor detects a pressure of a pressure transmitting medium. The pressure sensor includes a sensor substrate and a protection film. The sensor substrate includes a recess recessed relative to a periphery thereof and a thin portion thinner than the periphery due to the recess. The protection film is provided on a bottom surface of the recess that is one side of the thin portion and a part of a lateral surface of the recess, and the protection film suppresses an adhesion of a contamination contained in the pressure transmitting medium. The pressure sensor includes an adhesion suppressing portion that includes an uneven section formed in at least a part of the lateral surface, and a liquid repellent film repellent to liquid in the pressure transmitting medium and provided as the protection film on the uneven section to exhibit a lotus effect.

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Kariya, Japan

Kazuaki Mawatari