Canon Anelva Corporation

Mitsubishi Gas Chemical Company, Inc.

Nhk Spring Co., Ltd.

Toto Ltd.

Anelva Corporation

Choshu Industry Co., Ltd.

Kazuaki Kaneko

Masayoshi Ikeda

Yasumi Sago

Takuji Okada

Noriyuki Kato

Shu Yoshida

Keiichi Kameyama

Hiroki Furuhashi

Jun Hagiwara

Toshihiro Tachikawa

Takashi Kayamoto

Jun Miyaji

Noriaki Tateno

Tadashi Inokuchi

Masahiko Tamaru

Tomio Takamura

Tadashi Hirayama

Yoshiyuki Ikemura

Toshiaki Yamada

Yoshinori Isahaya

Eitarou Morimoto

You Tanaka

Yoshiki Aruga

Yuki Kumagai

Kazuya Sekihara

To provide a polycarbonate resin composition having a high Abbe's number, high strength and excellent stainability. Disclosed is a polycarbonate resin composition prepared by blending

Polycarbonate resin composition

To provide a polycarbonate resin composition excellent in low-birefringence and strength. Disclosed is a polycarbonate resin composition prepared by blending  

The invention relates to a method for producing a thermoplastic resin, comprising using a composition at least comprising a fluorene-containing dihydroxy compound represented by the following formula (1) and a fluorene-containing hydroxy compound represented by the following formula (2) in an amount of from 0.5 parts by weight to 1.5 parts by weight relative to 100 parts by weight of the fluorene-containing dihydroxy compound of formula (1). 

Method for producing thermoplastic resin, polyester resin and polycarbonate resin, and their applications

The present invention relates to a polycarbonate resin composition which comprises a polycarbonate resin having the repeating unit that is represented by the following general formula (1) and a hydroxyl group at terminal thereof and has the concentration of the terminal hydroxyl group of 1000 ppm or more.

Polycarbonate resin composition and method of producing the same

A method of using a heat exchanger efficiently and uniformly to cool or heats portions to be controlled to a prescribed temperature, and then continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.

Semiconductor device manufacturing method

An electrostatic chuck includes a dielectric board having an upper surface on which a plurality of projections for supporting a substrate on top surfaces and recesses surrounding the projections are formed, an electrode formed inside the dielectric board, and an external power supply which applies a voltage to the electrode. The dielectric board includes a conductor film formed on at least the top surface of each projection, and has a three-dimensional structure which causes the conductor film to generate a Johnson-Rahbeck force between the substrate and conductor film when a voltage is applied to the electrode.

Electrostatic chuck

This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

Electrostatic chucking stage and substrate processing apparatus

An electrostatic chuck module for a semiconductor manufacturing apparatus which can be cooled with water and in which there is no penetration leak includes an electrostatic chuck plate of alumina and a cooling plate which is bonded to the electrostatic chuck, wherein the cooling plate is formed by forging processing to a Cu-based composite material comprising Cu&#x2014;W, Cu&#x2014;W&#x2014;Ni, Cu&#x2014;Mo, or Cu&#x2014;Mo&#x2014;Ni. By adjusting the ratio of Cu and Ni having a great thermal expansion coefficient and W and Mo having a small thermal expansion coefficient in a Cu-based composite material, it is possible to obtain a highly thermally conductive material having the same thermal expansion coefficient as an alumina material for an electrostatic chuck. However, since such a composite material has a penetration leak, it cannot be used in a vacuum system. According to the present invention, by conducting forging processing, a penetration leak can be prevented. Also, corrosion resistance which is important for a cooling plate can be improved by applying a Ni, Cr or Cu film by plating or sputtering.

Electrostatic chuck module and cooling system

A heat exchanger efficiently and uniformly cools or heats portions to be controlled to a prescribed temperature, and then provides a surface processing apparatus which makes it possible to continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.

Substrate processing apparatus

This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses optimum total thickness of the ESC stage, optimum volume ratio of composite which the moderation layer is made of, and an optimum range of the thermal expansion coefficient of the composite. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

A brine supply unit for supplying brine to at least one load after controlling the brine so as to meet a target temperature of the load comprises: a heat exchanger disposed at a brine-cooling channel, through which the brine returned from the load flows, for cooling the brine with water for industrial use; a heater disposed at a brine-heating channel formed in parallel with the brine-cooling channel, through which the brine flows, for heating the brine; a mixing section disposed at a connecting portion between the brine-cooling channel and the brine-heating channel, for mixing the cooled brine and the heated brine; and a tank disposed between the mixing section and the load, which has a capacity of about 10 liters or more and is constructed so that the brine can pass therethrough slowly to relieve a sudden temperature change of the brine.

Growing community of inventors

Tokyo, Japan

Kazuaki Kaneko