Oscps Motion Sensing Inc.

Other

Kazem Zandi

Yoann Jestin

Pierre Pottier

Low loss photonic waveguides and ring resonators are necessary for highly accurate gyroscope functionality. For fabrication of these low loss waveguides and ring resonators, an improved and cost-effective fabrication method has been proposed wherein for silicon nitride waveguides, a minimum of 2 μm thin bottom oxide cladding above etched trenches (cavities) in silicon facilitates both lower losses and higher Q values ring resonators as compared to the conventional 8 μm thick bottom oxide cladding without etched trenches in silicon. The trenches below the thin bottom oxide cladding are created through xenon difluoride (XeF2) gas etching in selective areas of silicon substrate through vias (openings). After etching the trenches, these vias are filled by the addition of a final top oxide cladding layer. The proposed method provides about three times improvement both in propagation losses as well as in quality factor for side coupled ring resonators.

Low-loss photonic waveguides and ring resonators and a method for low-loss photonic waveguide and ring resonator fabrication

An optical waveguide structure for an optical gyroscope, the structure including a substrate; at least a first silicon nitride waveguide loop and a second silicon nitride waveguide loop connected to the substrate, the first silicon nitride waveguide loop and the second silicon nitride waveguide being disposed at different vertical distances from the substrate; at least one vertical coupler optically coupling the first silicon nitride waveguide loop to the second silicon nitride waveguide; and a plurality of air cavities defined in material below the first and second silicon nitride waveguide loops, no air cavities being defined in regions immediately below a coupling region defined around the at least one vertical coupler.

Interferometric integrated optical gyroscopes

The disclosed structures and methods are directed to a chip for an optical gyroscope and methods of manufacturing the chip for the optical gyroscope. The chip comprises a substrate, a waveguide having a first waveguide cladding layer and a waveguide core; and a ring resonator having a first ring cladding layer and a ring resonator core attached to the first ring cladding layer. A side wall of the ring resonator core forms an obtuse angle with an upper surface of the substrate. The method comprises etching a ring groove and a waveguide groove; placing the optical fiber ring into the ring groove and the optical fiber waveguide into the waveguide groove. The method further comprising splicing two ends of an optical fiber; annealing the ring junction of the optical fiber ring; and attaching the optical fiber waveguide to the waveguide groove and the optical fiber ring into the ring groove.

Optical gyroscopes and methods of manufacturing of optical gyroscopes

The disclosed structures and methods are directed to a chip for an optical gyroscope and methods of manufacturing of the chip for the optical gyroscope. The chip comprises a substrate, a waveguide having a first waveguide cladding layer and a waveguide core; and a ring resonator having a first ring cladding layer and a ring resonator core attached to the first ring cladding layer. A side wall of the ring resonator core forms an obtuse angle with an upper surface of the substrate. The method comprises depositing a first cladding layer on an upper surface of a silicon substrate; depositing a core layer; depositing a resist mask pattern to define a form of a ring resonator core and a form of a waveguide core; etching the core layer outside of the resist mask pattern; and stripping the resist mask pattern off.

A micro-opto-electromechanical systems (MOEMS) device is described. The device comprises at least one anchor on a chip; at least one spring connected to the anchor; at least one proof mass connected to the spring, the at least one proof mass being movable with respect to the chip; a movable optical element connected to the at least one proof mass; a first waveguide connected to the chip, the first waveguide being adapted for receiving light from a light source and a second waveguide connected to the chip, the second waveguide being adapted for operatively coupling to a photodetector and the movable optical element being disposed between the back end of the first waveguide and the front end of the second waveguide.

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Montreal, Canada

Kazem Zandi