Hrl Laboratories, LLC

Kayleigh A Porter

Tobias A Schaedler

Phuong Bui

Jacob Michael Hundley

John Hunter Martin

Zak C Eckel

Raviv Perahia

Logan D Sorenson

Florian G Herrault

Kevin Geary

Mark O'Masta

Matthew J Pelliccione

Minh B Nguyen

An interposer for a curved detector. In some embodiments a system includes a curved array photodetector; a first readout integrated circuit, the first readout integrated circuit being substantially flat; and an interposer, between the photodetector and the first readout integrated circuit. The photodetector and the first readout integrated circuit may each have a plurality of electrical contacts. The interposer may include a first conductor connecting a first contact, of the plurality of electrical contacts of the photodetector, and a second contact, of the plurality of electrical contacts of the first readout integrated circuit.

Interposer for curved detector

A ceramic article. In some embodiments, the ceramic article includes a ceramic body composed of a ceramic material; and a first conductive trace, the first conductive trace having a first portion entirely within the ceramic material, the first portion having a length of 0.5 mm and transverse dimensions less than 500 microns, the ceramic material including a plurality of ceramic particles in a ceramic matrix.

Method of manufacturing a ceramic structure with metal traces

3D printed ceramic structure with metal traces

Some variations provide a composition for additive manufacturing (3D printing) of metals, comprising: from 10 vol % to 70 vol % of a photocurable liquid resin; from 10 vol % to 70 vol % of metal or metal alloy particles, optionally configured with a photoreflective surface; and from 0.01 vol % to 10 vol % of a photoinitiator. Other variations provide a composition for additive manufacturing of metals, comprising: from 1 vol % to 70 vol % of a photocurable liquid resin; from 0.1 vol % to 98 vol % of an organometallic compound containing a first metal; from 1 vol % to 70 vol % of metal or metal alloy particles containing a second metal (which may be the same as or different than the first metal); and from 0.01 vol % to 10 vol % of a photoinitiator. Many examples of metals, photocurable resins, organometallic compounds, photoinitiators, and optional additives are disclosed, and methods of making and using the composition are described.

Resin formulations for additive manufacturing of metals, and methods of making and using the same

A stress isolating interposer includes: an outer pad; an inner pad configured to accommodate a positional sensor is mounted; and a stress isolating structure coupling the outer pad and the inner pad to each other. The outer pad, the stress isolating structure, and the inner pad are a monolithic structure.

Stress isolating interposer and sensor package and method of manufacturing the same

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Malibu, CA, United States of America

Kayleigh A Porter