Sae Magnetics (h.k.) Limited

Kayip Wong

Shenkuang Chou

Lu Xiao

Liping Peng

Yanbin Wang

Bin Zhao

Juren Ding

Yiusing Ho

Xiangyuan Tan

Chiwai Lo

Junqun Zhang

A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.

Nozzle for connecting or disconnecting solder joints between head bonding pads in a hard disk drive, and laser soldering or reflowing tool with the same

A magnetic recording head includes a trailing surface and a plurality of bonding pads arranged on the trailing surface and in a row adapted for both bonding and testing. Each of the bonding pads has at least one side portion being coated with electrically conductive solder nonwettable coat to prevent short circuit between the adjacent bonding pads. The invention also discloses a head gimbal assembly with the magnetic recording head and a disk drive unit having such head gimbal assembly.

Magnetic recording head, head gimbal assembly, and disk drive unit with the same

A slider for a head gimbal assembly includes a trailing surface, a plurality of connection pads arranged on the trailing surface adapted for both bonding the slider to a suspension of the head gimbal assembly and testing the performance of the slider. At least a part of the connection pads each comprises a bonding portion and a testing portion electrically connected to the bonding portion and larger than the bonding portion, all the bonding portions and the rest part of the connection pads are arranged in a first row and the testing portions are arranged outside the first row. The slider of the present invention has a new pad layout to facilitate bonding of the connection pads and permit to provide additional pads thereon to connect the additional sensors therein for precise reading and writing, thereby improving the performance of the slider. The invention also discloses a head gimbal assembly and a disk drive unit including the same.

Slider, head gimbal assembly and disk drive unit with the same

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Hong Kong, China

Kayip Wong