Atotech Deutschland Gmbh

Kay Wurdinger

Lutz Stamp

Lutz Brandt

Frank Brüning

Christian Wendeln

Bexy Dosse

Gerson Krilles

Tang Cam Lai Nguyen

Constanze Donner

Guenther Bauer

Therese Stern

Frank Bruening

Stefanie Bremmert

Marius Gernhard

Günther Bauer

Lutz Brand

A process for depositing metal or metal alloy on a substrate including treating the substrate surface with an activation solution comprising a source of metal ions so the metal ions are adsorbed on the substrate surface, treating the obtained substrate surface with a treatment solution containing an additive selected from thiols, thioethers, disulphides and sulphur containing heterocycles, and a reducing agent suitable to reduce the metal ions adsorbed on the substrate surface selected from boron based reducing agents, hypophosphite ions, hydrazine and hydrazine derivatives, ascorbic acid, iso-ascorbic acid, sources of formaldehyde, glyoxylic acid, sources of glyoxylic acid, glycolic acid, formic acid, sugars, and salts of aforementioned acids; and subsequently treating the substrate surface with a metallizing solution comprising a source of metal ions to be deposited such that a metal or metal alloy is deposited thereon.

Process for depositing a metal or metal alloy on a surface of a substrate including its activation

The present invention describes a method for the measurement of the stabilizer additive concentration in electroless metal and metal alloy plating electrolytes comprising a voltammetric measurement. Said method comprises the steps a. conditioning of the working electrode, b. interaction of intermediates on the working electrode, c. measurement of the Faradaic current and d. determining the Faradaic current.

Method for control of stabilizer additives in electroless metal and metal alloy plating electrolytes

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Berlin, Germany

Kay Wurdinger