Advanced Thermal Solutions, Inc.

Lucent Technologies Inc.

At&t Bell Laboratories

Other

At+t Corp.

At&t Laboratories, Limited

Kaveh Azar

Anatoly Pikovsky

Bahman Tavassoli-Hojati

Vineet Sunil Barot

Joseph P Mennucci

Carlo Mandrone

Richard E Caron

Mehmet Mustafa

Bahman Tavassoli Hojati

Geng Qian

Embodiments relate to a thermal management apparatus including an evaporator plate (EP) configured to receive heat from a heat source, a condenser plate (CP) including at least one reservoir, and a wick plate (WP) positioned between the EP and CP. The WP includes a plurality of wick cells and a return passage. The wick cells include a first wick cell and a second wick cell separate from one another and nested in the WP. The first and second wick cells respectively include first and second wick materials constructed to permit capillary transport of fluid from the CP reservoir to the evaporator plate. The return passage is separate from the first and second wick cells and fluidly communicates the evaporator plate with the CP reservoir. The EP, CP, and WP establish a two-phase multi-loop transport structure including at least the plurality of wick cells, the return passage, and the CP reservoir.

Thermal management multi-loop transport apparatus, and related methods

Embodiments relate to a system and method for dissipating heat from a heat generating component. The system and method an assembly of a fenestrated housing and a plenum and positioning of the assembly relate to the heat generating component. The plenum accommodates a fluid mover relative to the fenestrated housing. The fenestrations function to support multi-directional fluid flow created by the fluid mover and accommodated by the fenestrations, which function as ports to direct fluid with respect to the heat generating component.

Fluid mover enclosure

Embodiments relate to a system, an apparatus, and a method that involve a plurality of stackable enclosure units that include inter-unit or inter-module passages for facilitating cooling of interior compartments of the units, especially server units.

Stackable enclosure system with cooling features, and related apparatus and methods

Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.

Cold plate heat exchanger

Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.

Multiple flow entrance heat sink

Heat sink clip and attachment

Heat sink clip

A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Heat sink assembly

A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, thereby eliminating employment of a secondary heat dissipating material between the package and the heat dissipating device.

Electronics package with integrated lugs for cooling attachment

An electronics cooling system in accordance with the principles of the present invention includes an electronics cabinet that is thermally connected with the ground in the vicinity of the cabinet. The cabinet may or may not sit directly on the earth, but the thermal connection is made with the earth below, and in the near vicinity of, the cabinet, thereby employing the earth as a heat sink. In an illustrative embodiment, an enclosed cabinet includes a heat pipe that makes thermal contact with the ground in the immediate vicinity of the electronics cabinet. An electronics cabinet in accordance with the principles of the present invention is particularly suited for use in uncontrolled environments, such as may be encountered by remote telecommunications switches and wireless telecommunications equipment, for example.

Growing community of inventors

Westwood, MA, United States of America

Kaveh Azar