Applied Materials, Inc.

Other

Kaushik Vaidya

Evans Yip Lee

Hamid Noorbakhsh

Bryan Y Pu

Paul E Luscher

Dmitry Lubomirsky

Richard Charles Fovell

Prerna Sonthalia Goradia

Michael D Welch

Siamak Salimian

Hongching Shan

Yan Rozenzon

Geetika Bajaj

Brad L Mays

Yixing Lin

Kevin A Papke

Laksheswar Kalita

Gerhard M Schneider

Gangadhar Sheelavant

Ankur Kadam

Cariappa Achappa Baduvamanda

Yogita Pareek

Bopanna Ichettira Vasantha

Bipin Thakur

Dong Ho Choi

Gil Lavi

Jim Carducci

Matt Hamrah

Hung Dao

Hongging Shan

A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber has a base component body. The base component body has an exterior surface configured to face a processing environment of the processing chamber. A textured skin is conformable to the exterior surface. The textured skin has a first side configured to be disposed against the exterior surface and a second side facing away from the first side. The second side has a plurality of engineered features configured to enhance adhesion of material deposited on the textured skin during use of the processing chamber.

Textured skin for chamber components

The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.

Method for forming yttrium oxide on semiconductor processing equipment

The present invention provides a temperature controlled energy transparent window or electrode used to advantage in a substrate processing system. The invention also provides methods associated with controlling lid temperature during processing and for controlling etching processes. In a preferred embodiment the invention provides a fluid supply system for the lid which allows the fluid to flow through a feedthrough and into and out of a channel formed in the window or electrode. The fluid supply system may also mount the window or electrode to a retaining ring which secures the window or electrode to the chamber. In another aspect the invention provides a bonded window or electrode having a first and second plate having a channel formed in the plates so that when the plates are bonded together they form a channel therein through which a temperature controlling fluid can be flowed. An external control system preferably regulates the temperature of the fluid.

Temperature controlled window with a fluid supply system

A plasma reactor embodying the invention includes a wafer support and a chamber enclosure member having an interior surface generally facing the wafer support. At least one miniature gas distribution plate for introducing a process gas into the reactor is supported on the chamber enclosure member and has an outlet surface which is a fraction of the area of the interior surface of said wafer support. A coolant system maintains the chamber enclosure member at a low temperature, and the miniature gas distribution plate is at least partially thermally insulated from the chamber enclosure member so that it is maintained at a higher temperature by plasma heating.

Plasma reactor cooled ceiling with an array of thermally isolated plasma heated mini-gas distribution plates

A substrate support assembly comprises a substrate support and a collar which may comprise at least one slit . The slit allows for thermal expansion compensation in the support assembly . The collar may, for example, protect the dielectric from erosion in a process chamber . In one version, the collar comprises a clamping ring on the dielectric

Support assembly with thermal expansion compensation

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Sunnyvale, CA, United States of America

Kaushik Vaidya