Sony Corporation

Hosiden Electronics Co., Ltd.

Katutoshi Amano

Toshio Kakuta

A contact array plate having a plurality of contact pieces arranged to extend between first and second coupling pieces is formed by punching of a sheet of metal. A first housing half is molded integrally with the contact array plate so that intermediate portions of the contact pieces are buried in the first housing half. Then the first and second coupling pieces are cut off to separate the contact pieces from one another and outwardly projecting portions of the contact pieces are bent along shaped sections of the peripheral surface of the first housing half to form contact propers. A second housing half acting as bending dies is assembled with the first housing half with the contact propers inside thereof to define therebetween an insertion opening for receiving a mating connector.

Method for the manufacture of a printed-circuit board connector

A second body half formed by a substantially rectangular metal plate is assembled with a substantially rectangular parallelepipedic first body half fabricated of a synthetic resinous material to form a connector proper, with a printed-circuit sheet insertion opening defined therebetween for receiving a mating printed-circuit sheet. In the printed-circuit sheet insertion opening, the first body half has formed therein side by side in its lengthwise direction contact member receiving grooves extending in the direction in which a printed-circuit sheet is inserted into the printed-circuit sheet opening. Contact members are mounted in the contact member receiving grooves, the contact members being fixedly held by the first body half.

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Yokohama, Japan

Katutoshi Amano