Hitachi, Ltd.

Shikoku Electric Power Co., Inc.

Hitachi Chemical Company, Ltd.

Katuo Sugawara

Akio Takahashi

Toshikazu Narahara

Masahiro Ono

Akira Nagai

Motoyo Wajima

Junichi Katagiri

Ritsuro Tada

Hideo Tsukioka

Etsunori Mori

Minoru Yamada

Keiichirou Nakanishi

Shigeo Shiono

Etsuo Ohe

Seiichi Sakai

Ichitaro Tani

Ictitaro Tani

Toshihiko Gange

Sukekazu Aratani

Kazuya Takahashi

Hitoshi Yokono

Noriyuki Kinjo

Ryoichi Kajiwara

Akira Kageyama

Tsuneaki Kawanishi

Akira Masaki

Toshiro Saito

Masatoshi Watanabe

Masahiro Suzuki

Takao Funamoto

Toru Koyama

Junji Mukai

Shigeo Suzuki

Yoshiharu Karasawa

Tomohiko Shida

Yasuo Katsuya

Hiroshi Wachi

Akira Hosoya

Tadashi Muroi

Keiko Tawara

Syoichi Maruyama

Takeshi Matsuzaka

Kenji Mishima

Mituo Katou

Shinichi Yamashiro

Mitsuo Mashiko

Electrically insulated coils having excellent moisture resistance or water resistance utilize a simple material that is readily available. Using a simple method of manufacture, rotating electric machines such as motors for driving pumps, traction motors for rolling stocks and the like suitable for use in the outdoors may be built with the electrically insulated coils. The coils are coated with a fluorine-containing coating at least on portions which are exposed out of the side of the core. Since a uniform hydrophobic layer utilizing the repellent action of fluorine atoms is capable of being provided on the surface of the electrically insulated coils, the electrically insulated coils and the rotating electrical machines incorporating them feature excellent moisture resistance and water resistance.

Electrically insulated coils and a method of manufacturing thereof

A photosensitive element for electrophotography has an electrically conductive substrate and a layer structure thereon comprising a charge generating substance and a charge transport substance. An improved charge transport substance is a derivative of triphenylamine in which at least 80% of the electrons in the highest occupied molecular orbital are located on the triphenylamine skeleton. Examples of such compounds have the following formula: ##STR1## wherein X is a an optionally substituted heterocyclic radical containing at least one ring nitrogen, Q is a single bond or --C.dbd.C--, and Z.sub.1, Z.sub.2 and Z.sub.3 are H, lower alkyl or alkoxy, aryl, NO.sub.2, CF.sub.3, --N(R').sub.2, --S--C.sub.6 H.sub.5 or --S(R').sub.2.

Photosensitive element for electrophotography

The present invention provide a thermosetting resin composition comprising

Thermosetting resin composition, and prepreg and laminated sheet which

The present invention provides a thermosetting resin composition comprising

Prepreg from poly(p-hydroxystyrene), epoxy-modified polybutadiene and

The dislocation between each layer in a multi-layer circuit board and a process for producing the same and an application of the same is minimized by employing a specific adhesive layer between layers of the circuit board. The adhesive layer is composed of a film of a resin having a melting point higher than a temperature for forming the multi-layer (or laminated layer) circuit board and adhesive having a melting point lower than the temperature for forming the multi-layer circuit board.

Multi-layer circuit board, method of manufacturing the same and

A resin composition for printed circuit board and the printed circuit board in which said resin composition is used as substrate, said resin composition comprising one or more cyclic phosphonitrile compounds represented by the general formula [I] and/or [II] and an aromatic maleimide compound and/or an aromatic amine: ##STR1## wherein at least two of R's (R.sub.1 to R.sub.8) are groups represented by ##STR2##

Resin composition for printed circuit board

Resin composition for printed circuit board and such board formed by use

Composition comprising poly(p-hydroxystrene) derivative, epoxy-modified

An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof. This integrated circuit device has a power source substrate of a remarkably high heat radiating efficiency, and is suitably used as an integrated circuit device having integrated circuit chips mounted with a high density on a wiring substrate therein.

Integrated circuit device

A thermosetting resin composition comprising as essential constituents (a) a prepolymer comprising a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A represents a hydrogen or halogen atom or an alkenyl or alkenoyl group having 2 to 4 carbon atoms, m represents a number in the range of from 1 to 4, and n represents a number in the range of from 1 to 100, and (b) a 1,2-polybutadiene or a derivative thereof. By using this novel resin composition and a customary equipment and procedure, it is easy to obtain a tack-free prepreg which is able to produce laminated materials of low permittivity suitable for use in multilayer printed circuit boards improved in peel strength of bonded copper foil, mechanical strengths, flame retardancy, and heat resistance, as compared to conventional printed circuit boards.

Thermosetting resin composition and laminate and process for the

Cured resin obtained by polymerization by heating of a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic polymerization temperature ranges at polymerization by heating substantially coincide with each other, for example, an aromatic maleimide compound and an aromatic cyanamide compound, the composition showing a substantially one exothermic polymerization peak at the polymerization by heating, has a good heat resistance, and a laminated, high density wiring board with a good heat resistance, capable of being directly loaded with LSI chips and chip carriers can be obtained, using the composition.

Thermo-setting, polymerizable composition and wiring board

A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permittivity and another type of insulation layer having higher relative permittivity is used between power (ground) line layers interposed by signal line layer(s).

Hybrid multilayer wiring board

The thermosetting resin composition of the present invention is prepared by mixing an aromatic cyanamide compound with a cyclic ester compound and/or a cyclic amide compound. Although a solventless type composition is preferable, the present invention is not limited thereto. The cured product of the present invention can be prepared by heating and curing said thermosetting resin composition. The obtained cured product of the present invention usually contains melamine rings, isomelamine rings and linear polyester and/or a linear polyamide units.

Thermosetting resin composition from aromatic cyanamide

A resin composition comprising a prepolymer of homopolymer or copolymer of isocyanuric acid derivative or cyanuric acid derivative, and a cyclized polybutadiene can give a laminate for multi-layer printed circuit boards excellent in heat resistance, dimensional stability and high-frequency electrical properties.

Resin composition and laminate produced therefrom comprising a cyclized

Method and apparatus for diagnosing abnormality of an oil-filled electric apparatus is disclosed. Presence or absence of abnormality is determined by comparing contents of plural predetermined components contained in gas extracted from the oil of the electric apparatus with respective predetermined reference values. The type of abnormality is determined on the basis of at least one set of two specific components selected from the plural components.

Method and apparatus for diagnosing oil-filled electric apparatus

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Hitachi, Japan

Katuo Sugawara