Nichia Corporation

Katsuyuki Tsunano

Masafumi Kuramoto

Shuji Shioji

Daisuke Niki

Takuma Arikawa

A silicone resin composition includes a silicone resin and a ceria-zirconia solid solution, with the solid solution being contained in a range of 0.01 to 2 parts by mass relative to 100 parts by mass of the silicone resin.

Silicone resin composition and method of producing same

A method for producing a light emitting device, including: integrally molding plural leads with a molded resin portion comprising a resin composition containing a thermosetting resin or a thermoplastic resin, so as to prepare a substrate having a concave portion having a side surface and a bottom surface; disposing a light emitting element on the bottom surface of the concave portion; forming a film including a metal oxide on the side surface of the concave portion and an upper surface of the substrate; disposing a sealing resin composition containing an addition curing silicone resin composition containing an organopolysiloxane containing a functional group capable of performing a crosslinking reaction and an aryl group in one molecule, and an organic modified silicone oil that is unreactive with the organopolysiloxane, in the concave portion; and curing the sealing resin composition to form a resin package.

Method for producing light emitting device and sealing resin composition for light emitting device

To provide a light emitting device that can suppress the increase in pits and projections caused by the thermal history of the reflective film on the surface of the reflective film used in the light emitting device, the light emitting device includes: a light emitting element; and a reflective film for reflecting light from the light emitting element, in which the reflective film contains silver as a principal component, and nanoparticles of an oxide.

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Tokushima, Japan

Katsuyuki Tsunano