Sumitomo Electric Industries, Limited

Fis Inc.

Ntt Docomo, Inc.

Sumitomo Electric Hardmetal Corp.

Abilit Corporation

Katsuyuki Tanaka

Naoji Fujimori

Katsuko Yamamoto

Yoshiaki Kumazawa

Nobuo Urakawa

Hideaki Morigami

Kazuo Onaga

Mariko Sugimura

Takahiro Imai

Tsutomu Nakamura

Hiromu Shiomi

Akihiko Ikegaya

Yutaka Kobayashi

Takashi Tsuno

Kazuwo Tsuji

Kazuo Nakamae

Satoshi Hiyama

Takahisa Iguchi

Yuki Moritani

Akito Yoshida

Hiroshi Koda

Junko Yanagitani

Mamoru Ono

Teruhiro Enami

Yuuki Yamada

Hiroyuki Murase

Toshimitsu Sakata

Noriko Kiyoshi

Tetuso Nakai

Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance. Provided are a cutting tool manufacturing method in which a cutting tool material is cut by using, as a laser beam, a laser beam formed by combining two linearly polarized laser beams so that the directions of polarization of the two linearly polarized laser beams are at right angles to each other; a cutting tool manufacturing method in which a circularly polarized laser beam is used as a laser beam; a cutting tool manufacturing method in which a randomly polarized laser beam is used as a laser beam; a cutting tool manufactured by the manufacturing method; a cutting tool manufacturing apparatus that includes means for generating a combined laser beam formed of two linearly polarized laser beams, the directions of polarization of the two linearly polarized laser beams being at right angles to each other and an optical system that guides the combined laser beam to the cutting tool material; a cutting tool manufacturing apparatus that includes means for generating a circularly polarized laser beam; and a cutting tool manufacturing apparatus that includes means for generating a randomly polarized laser beam.

Cutting tool and method and apparatus for manufacturing the same

A biological gas detection apparatus of an embodiment of the present invention includes: a sensor unit including plural types of gas sensors; a control unit of the sensor unit; a data recording unit; and a data analyzing unit, wherein the data recording unit includes a database on properties of sensitivities of the gas sensors for a single body of a desired gas component, a single body of an interference gas component, and a mixed gas of these that are included in the biological gas, and the data analyzing unit calculates concentration of the desired gas component based on sensitivities of the gas sensors output when detecting the biological gas and the database.

Biological gas detection apparatus and biological gas detection method

A gas chromatograph having the capability of performing a reliable measurement under a condition that the baseline of a detector output is stabilized, and a breath component analyzer using the same are provided. This gas chromatograph comprises a gas separation column accommodating a member for causing a flow delay depending on gas component; air pump for supplying an air as a carrier gas into the gas separation column; gas supply port formed in a gas flow channel extending between the air pump and the gas separation column, and adapted to supply a subject gas containing a target gas component to be detected into the carrier gas flowing in the gas flow channel; buffer tank provided upstream of the gas supply port; and a detector for detecting the gas component of the subject gas supplied into the gas separation column.

Gas chromatograph and expired air component analyzer

A conductive polycrystalline diamond film having specific resistance of at least 1&times;10,&OHgr;cm and less than,&OHgr;cm, whose film thickness is in the range of at least 0.1 &mgr;m and not more than 500 &mgr;m, is film-formed by vapor-phase synthesis on a surface employed for pressure bonding, a surface opposite to this surface or at least two side surfaces intersecting with these surfaces on a substrate of a bonding tool tip that is applicable for bonding and packaging a semiconductor chip.

Tool tip and bonding tool comprising the tool tip and control method for the bonding tool

A bonding tool capable of uniformly pressing all electrodes of a semiconductor element and surely bonding all the electrodes and leads, even if the end pressing surface of a tool end part of a bonding tool is enlarged with the large-sized and long-sized tendency of semiconductor elements, is provided in which an end pressing surface of a tool end part fitted to a shank is composed of a hard material, characterized in that the end pressing surface is gradually curved to form a concave surface from the peripheral part to the central part at an application temperature of the bonding tool and the degree of flatness of the concave end pressing surface is in the range of 1 to 5 .mu.m at the application temperature of the bonding tool.

Bonding tool, production and handling thereof

A bonding tool capable of uniformly pressing all electrodes of a semiconductor element and surely bonding all the electrodes and leads, even if the end pressing surface of a tool end part of a bonding tool is enlarged with the large-sized and long-sized tendency of semiconductor elements, is provided in which an end pressing surface of a tool end part fitted to a shank is composed of a hard material, characterized in that the end pressing surface is gradually curved to form a concave surface from the peripheral part to the central part at an application temperature of the bonding tool and the degree of flatness of tile concave end pressing surface is in the range of 1 to 5 .mu.m at the application temperature of the bonding tool.

A bonding tool for TAB, used in the production of semiconductor chips, which is provided with, at the end thereof, a substrate consisting of a member selected from the group consisting of sintered compacts of Si or Si.sub.3 N.sub.4 as a predominant component, sintered compacts of SiC as a predominant component, sintered compacts of AlN as a predominant component and composite compacts thereof, the substrate being coated with polycrystalline diamond deposited by gaseous phase synthesis method.

Bonding tool

A diamond tool, e.g., cutting tool, dresser, wire drawing die, etc., having excellent wear resistance, heat resistance and oxidation resistance and with an improved tool life is provided, which is mainly composed of a synthetic diamond single crystal containing boron or boron and nitrogen.

Diamond tool

A tool comprising a blank and shank, bonded at a low temperature through a bonding layer of gold formed by thermocompression bonding between the blank and shank is provided which can be used at a high temperature independently of the temperature at which the blank and shank were bonded.

Tool using gold as a binder

Growing community of inventors

Itami, Japan

Katsuyuki Tanaka