Sharp Kabushiki Kaisha Corporation

Katsuyuki Suga

Yuki Yasuda

In a display panel, a first slit is formed between a first terminal portion and a second terminal portion that are two of a plurality of terminal portions, and the first slit separates the first terminal portion and the second terminal portion between the first terminal portion and the second terminal portion.

Rollable electronic device with slit that separates terminal portions

A rollable electronic apparatus being windable, includes: a flexible electronic device; a flexible cable; a circuit substrate; and a support body having a tubular body, wherein the flexible electronic device includes a terminal portion, the flexible cable connects the terminal portion and the circuit substrate, a drive circuit is mounted on the circuit substrate, the flexible electronic device and the flexible cable are wound on an outer circumferential surface of the support body by rotating the support body, the support body has, in a cross-sectional view, two curved portions and a planar portion connecting the two curved portions, and the circuit substrate is stored in the planar portion in a state in which the flexible cable is wound.

Rollable electronic apparatus

An electronic device includes an electronic component having flexibility, a drive circuit substrate, a first support body capable of winding at least a portion of the electronic component around an outer face, and a second support body including a center axis that is the same axis as a rotation axis of the first support body and including an outer periphery having a length smaller than a length of an outer periphery of the first support body, the second support body being capable of winding at least a portion of the external connection cable around an outer face.

Electronic device and container

A terminal of a flexible organic EL display device is formed using a third conductive member being a second metal layer exposed through an opening of a second resin layer. In the opening of the second resin layer, a protruding portion being formed using a third resin layer being a layer lower than the second resin layer and the third conductive member being the second metal layer overlap each other.

Display device and method for manufacturing display device

A display device includes a flexible display panel, and an accommodation section configured to house the flexible display panel and provided with at least one movable guide member being movable and a plurality of fixed guide members configured to support the flexible display panel, where a distance between the at least one movable guide member and the plurality of fixed guide members at a time of pull-out is different from that at a time of housing.

Display device

A manufacturing method for an EL device including a mother substrate and a layered body including a light emitting element, the method includes irradiating a laser beams to peel the mother substrate and the layered body from each other, wherein the mother substrate and the layered body contact with each other via a resin layer of the layered body, a protection material is formed on a face of the layered body, the face of the layered body not contacting with the mother substrate, the irradiating includes irradiating a first laser beam and a second laser beam after the first laser beam, and an absorption rate of the second laser beam irradiation by the resin layer is greater than an absorption rate of the second laser beam irradiation by the protection material.

Manufacturing method for EL device

Provided is a method for manufacturing an EL device, the method including peeling a mother substrate from a layered body including a light-emitting element layer with irradiation with a laser. The mother substrate and the layered body are in contact with each other with a resin layer of the layered body interposed therebetween, and in a case that the peeling is performed by irradiating the resin layer with the laser, the irradiation is performed on at least a part of an end portion of the resin layer under a condition different from that in a central portion of the resin layer.

Manufacturing method for electroluminescence device

A display device includes: a support material; a TFT layer that includes a plurality of inorganic insulating films; a light emitting element layer; and a sealing layer. A slit pattern that penetrates through the plurality of inorganic insulating films is formed, in a plan view, outside a display region and inside edges of the support material.

Display device, production method of display device, production device of display device, and film formation device

A display device includes a display panelincluding a first substrateA having thin film patternsL on a section of a plate surface thereof and a second substrateA that is bonded to the first substrateA with sealantthat is disposed to surround the thin film patternsL, the display panelperforming displaying, and a resin filmhaving flexibility and configuring a section of the thin film patternsL and extending outside the sealantcontinuously from the thin film patternsL, the resin filmhaving a section outside the sealantand at least the section having metal linesthrough which signals for driving the display panelare transmitted.

Display device and method of producing display device

An objective of the present invention is to increase production efficiency of high-performance flexible semiconductor devices. A semiconductor device manufacturing method includes: a step of forming an insulating substrate () which is configured of glass substrates () with a thermal expansion coefficient which approximates the thermal expansion coefficient of a single-crystal silicon substrate () and a plastic substrate () which is positioned between both of the glass substrates; and a step of, after bonding the insulating substrate () with the single-crystal silicon substrate (), separating a portion of the single-crystal silicon substrate () with heat processing, and forming a single-crystal silicon layer () upon the glass substrate ().

Semiconductor device manufacturing method

A method for fabricating a semiconductor device includes a first step of forming, on a first substrate, a first element region in which a plurality of elements are collectively arranged, a second step of relocating the plurality of elements formed on the first substrate to a holding member in the same arrangement as in the first element region to have the plurality of elements held on the holding member, a third step of rearranging the plurality of elements held on the holding member and having the plurality of elements held on an intermediate substrate, thereby forming a second element region having a shape different from a shape of the first element region on the intermediate substrate, and a fourth step of dispersing the plurality of elements held on the intermediate substrate and adhering the plurality of elements to a second substrate.

Method for fabricating semiconductor device, and method for fabricating display device

A wire () and a pixel electrode () are formed on a surface of a flat supporting substrate () which surface is opposite to a surface on which a TFT () is formed. Accordingly, it is possible to provide an active matrix substrate () which makes it possible to suppress a decline in yield.

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Sakai, Japan

Katsuyuki Suga