International Business Machines Corporation

Globalfoundries Inc.

Katsuyuki Sakuma

Mukta G Farooq

Jae-Woong Nah

John Ulrich Knickerbocker

Mario John Interrante

Sarbajit Kumar Rakshit

Huan Hu

Paul Stephen Andry

Xiao Hu Liu

Shidong Li

Stephen John Heisig

Ning Li

Michael A Gaynes

Bucknell Chapman Webb

Eric D Perfecto

Amos Cahan

Charles L Reynolds

Rajeev Narayanan

Evan G Colgan

Bing Dang

Peter Alfred Gruber

Chandrasekhar Narayanaswami

Jeffrey Donald Gelorme

Da-Yuan Shih

Hilton T Toy

Kamal Kumar Sikka

Benjamin V Fasano

Krishna R Tunga

Qianwen Chen

Peter Jeffrey Brofman

Harry David Cox

Richard Francis Indyk

Yoshitami Sakaguchi

John Jeremy Rice

Donald Merte

Michael S Cranmer

Leanna Pancoast

Kevin Shawn Petrarca

Roy Rongqing Yu

Griselda Bonilla

Thomas Weiss

Minhua Lu

Li-Wen Hung

Michael P Belyansky

Kuniaki Sueoka

Nicholas A Polomoff

Shahid Ahmad Butt

Ravi K Bonam

Marcus E Interrante

Viatcheslav Gurev

Paolo Di Achille

Marlon Agno

Michael Angelo Stellitano

Gaddi Blumrosen

Russell Kastberg

Sébastien S Quesnel

Mukta Ghate Farooq

An apparatus for bonding a first substrate to a second substrate includes a heatable mounting stage configured to accommodate a first semiconductor substrate on an upward-facing surface and a first stack of semiconductor materials on the first semiconductor substrate; a heatable bond head configured to accommodate a second semiconductor substrate on a downward-facing surface and a second stack of semiconductor materials on the second semiconductor substrate; and a collet disposed on the downward-facing surface of the heatable bond head and configured to receive the second semiconductor substrate and the second stack of semiconductor materials. The heatable bond head is configured to have a vacuum applied thereto to deformably accommodate the second semiconductor substrate and the second stack of semiconductor materials against the collet. The heatable bond head is configured to be pressed against the heatable mounting stage to bond the semiconductor materials.

Structures and processes for void-free hybrid bonding

A computer implemented method for providing an online purchase includes displaying an electronic image of a plurality of items. A signal of a user drawn loop, drawn around one or more of the plurality of items in the electronic image is received through a network connection. The one or more items in the user drawn loop are identified. A cost for the items identified in the user drawn loop is determined. The cost is displayed.

Remote based online product selection

A stack structure that includes: a device wafer, a handler wafer, and a bonding structure disposed between the device wafer and the handler wafer, wherein one or both of the device wafer and the handler wafer have a release layer that is configured to be substantially or completely vaporized by infrared ablation when exposed to an infrared laser energy. The device wafer includes at least two consecutive layers adjacent the bonding structure that together include a plurality of fill portions that substantially or completely disable entry of the infrared laser energy into a plurality of layers of the device wafer below the two consecutive layers adjacent the bonding structure.

Infrared debond damage mitigation by copper fill pattern

Embodiments of the present invention are directed to a two-layer adhesive and methods of using the same to secure an electronic device to an organism. In a non-limiting embodiment of the invention, a surface of the organism is coated with a first adhesive layer (bottom layer). The first adhesive layer is cured and a surface of the cured first adhesive layer is coated with a second adhesive layer (top layer). An electronic device is positioned on the second adhesive layer prior to curing the second adhesive layer. The second adhesive layer is then cured, thereby embedding the electronic device within the second adhesive layer. The bottom layer and the top layer are selected such that the bottom layer releases upon exposure to a first solvent after a first duration and the top layer releases upon exposure to a second solvent after a second duration more than the first duration.

Two-layer adhesion of electronics to a surface

A computer implemented method for providing virtual reality shopping provides generating, by a virtual reality (VR) engine, a VR user interface (UI) and a VR session within a VR device. A list of discounted items being discounted based on proximity to an expiration or best by use date is received from the computing device of an institution item source. A VR image of virtual items on virtual shelves in the VR UI is displayed. The virtual items are dynamically displayed in different positions between a first VR session and a second VR session. Virtual representations of the discounted items being discounted are displayed in positions of priority on the virtual shelves, relative to other virtual items on the virtual shelves.

Dynamic virtual reality shopping shelf interface

An approach to provide a method of joining a semiconductor chip to a semiconductor substrate, the approach includes depositing a nanoparticle paste and aligning each of one or more solder contacts on a semiconductor chip to a substrate bond pad. The approach includes sintering, in a reducing gaseous environment, the nanoparticle paste to connect the semiconductor chip to a semiconductor substrate bond pad.

Sintering a nanoparticle paste for semiconductor chip join

Embodiments are provided for upgrading operating application in a multi-device ecosystem in a computing environment. Various types of computing devices are determined to be connected to a multi-device computing network. A collaboration plan is generated between the computing devices to execute an operating application operation event on each of the computing devices without interrupting user activities executing on each of the computing devices. Operating applications on each of the computing devices are upgraded according to the collaboration plan without interrupting each of the f user activities on each of the computing devices.

Upgrading operating software ('OS') for devices in a multi-device ecosystem

An approach to harvesting electrical energy from a user blinking is disclosed. The approach uses an apparatus that includes a piezoelectric film attaching to a user's eyelid, a wire connecting the piezoelectric film to an electronic component; and an antenna surrounding an eye of the user connecting to the electronic component. The approach includes harvesting electrical energy from a user blinking with the piezoelectric film and the antenna wirelessly transmitting the electrical energy to smart contact lens worn by the user.

Piezoelectric device powering smart contact lens with eyelid movement

An item storage system includes a shelving portion and a replenishment portion. The shelving portion includes: a first shelf having a toroidal shape with a center axis; and a second shelf having a toroidal shape that is spaced apart from the first shelf along the center axis. The replenishment portion includes: an elevator portion configured to deliver items to the first shelf and the second shelf, wherein at least part of the elevator portion is positioned in the center of the shelving portion and is surrounded by the shelving portion; and a storing portion configured to load items into the elevator portion, wherein the storing portion is positioned above or below the shelving portion.

Cognitive rotatable item storage with automated replenishment

An interconnect for a semiconductor device includes a laminate substrate; a first plurality of electrical devices in or on a surface of the laminate substrate; a redistribution layer having a surface disposed on the surface of the laminate substrate; a second plurality of electrical devices in or on the surface of the redistribution layer; and a plurality of transmission lines between the first plurality of electrical devices and the second plurality of electrical devices. The surface of the laminate substrate and the surface of the redistribution layer are parallel to each other to form a dielectric structure and a conductor structure.

High density interconnection and wiring layers, package structures, and integration methods

A semiconductor die package that has a substrate with one or more substrate layers with one or more substrate connections. A substrate layer can include one or more redistribution layers (RDLs). One or more dies (e.g., multiple dies) are disposed on a top substrate layer. The dies have one or more die external connections. Some of the die external connections are electrically connected to one or more substrate connections. One or more metallic dam stiffeners form into a dam enclosure that is disposed on and physically connected to the top substrate layer. The dam enclosure encloses one or more of the dies. The metallic dam enclosure has one or more electrically connected regions where the metallic dam enclosure is electrically connected to one or more of the substrate horizontal connections and one or more electrically insulated regions where the metallic dam enclosure is electrically insulated from one or more of the substrate horizontal connections and the substrate via connections. In different embodiments, the dam enclosure stiffens the substrates/package during manufacture, assembly, and operation; provides confinement for underfill application; and provides a heat conduction path for heat removal. Methods of manufacturing and assembling the die package are disclosed.

Multiple die assembly

Systems, computer-implemented methods and/or computer program products that facilitate wearable multiplatform sensing are provided. In one embodiment, a computer-implemented method comprises: measuring, by a system operatively coupled to a processor, wirelessly on a nail plate, physiological data of an entity; integrating and synchronizing, by the system, the physiological data with other physiological data from one or more devices to form integrated physiological data; and analyzing, by the system, the integrated physiological data to detect one or more disorders.

Wearable multiplatform sensor

An electronic structure includes offset three-dimensional stacked chips; and a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips.

Electronic package structure with offset stacked chips and top and bottom side cooling lid

A semiconductor device and formation thereof. The semiconductor device includes a first semiconductor structure, a second semiconductor structure, and a plurality of pillars interconnecting the first semiconductor structure and the second semiconductor structure. The plurality of pillars include a first solder layer and a second solder layer, wherein the first solder layer has a higher melting point than the second solder layer.

Temperature hierarchy solder bonding

A method, a structure, and a computer system for a modular sensing unit. The structure comprises a sensor module, a power cable ribbon, and a component module, wherein the component module is in communication with and detachable from the sensor module via the power cable ribbon.

Modular sensing unit

Growing community of inventors

Fishkill, NY, United States of America

Katsuyuki Sakuma