Murata Manufacturing Co., Ltd.

Katsuyuki Moriyasu

Tadahiro Nakagawa

Masami Yamaguchi

Koichi Nitta

Kazuma Kabuta

Mitsuro Hamuro

Hirokazu Higuchi

Shizuma Tazuke

Fumihiko Kaneko

Akihiko Takahashi

An electrode forming apparatus comprises a recovery blade for collecting electrode paste on the bottom surface of a dipping vessel toward a first end of the dipping vessel and a levelling blade for levelling the electrode paste, being collected toward the first end, toward a second end of the dipping vessel for adjusting the same to a constant film thickness. The recovery blade and the levelling blade are supported by a blade support frame, which is horizontally reciprocated with respect to the dipping vessel. The recovery blade is vertically moved by a cylinder, while the vertical position of the levelling blade is finely controlled by a levelling control motor. Thus, the film thickness of the electrode paste can be accurately adjusted with excellent repeatability, thereby carrying out homogeneous electrode application.

Electrode forming apparatus

A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate, with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.

Tool for forming external electrodes of chip parts

A wound unit of an electronic components series comprises a cylindrical core and a tape-shaped electronic components series wound in layers on its circumferential surface. On the periphery of the core, there is formed a slit. The electronic components series include a carrier tape made of a cardboard or the like on which not only the feeding holes having a certain pitch are formed but also many through holes responding to the shape of electronic components to be contained therein are distributed in a longitudinal direction. In each of these through holes are contained electronic components and on both of the main surfaces of the carrier tape, cover tapes are adhered to seal off the through holes. The tip of the electronic components series is inserted into the slit of the core and the electronic components series is wound in layers on the circumferential surface of the core. Adhesion layers are formed on the upper surface of the side of the carrier tape provided with the feeding holes of the electronic component series, each layer of the electronic components series being bonded to the next layer by the adhesion agent.

Wound unit of an electronic components series

A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.

Growing community of inventors

Kyoto, Japan

Katsuyuki Moriyasu