Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Other

Skhynix Inc.

Mazda Motor Corporation

Tokyo Roki Co., Ltd.

Katsuyuki Fujita

Takashi Ohsawa

Yoshihisa Iwata

Katsuhiko Hoya

Yoshihiro Ueda

Kosuke Hatsuda

Kenji Tsuchida

Fumiyoshi Matsuoka

Shintaro Sakai

Masahiro Takahashi

Masahiko Nakayama

Tamio Ikehashi

Hiroyuki Kanaya

Akihide Takami

Shinichiro Shiratake

Keisuke Nakatsuka

Yuui Shimizu

Akira Katayama

Yoshinori Kumura

Masahiko Shigetsu

Hideharu Iwakuni

Masaaki Akamine

Kaoru Nakagawa

Hisaya Kawabata

Hyuck Sang Yim

Hiromi Noro

Tadashi Tokuyama

Tomohiko Kawamoto

A semiconductor memory device includes a power source pad, a first bank including a plurality of memory cells, a second bank including a plurality of memory cells, the first bank being sandwiched between the power source pad and the second bank, first power supply lines connected to the power source pad and supplying power to the first bank and not to the second bank, and second power supply lines connected to the power source pad, passing over the first bank, and supplying power to the second bank and not to the first bank.

Semiconductor memory device

A memory includes a bit line connected to a memory cell and a read circuit to execute reading of data from the memory cell. The read circuit includes a first circuit having a first input terminal and detecting an output signal from the memory cell, a first transistor to control a current supplied to the memory cell based on a first control signal, and a second transistor. One terminal of the first transistor is connected to the first input terminal, the other terminal of the first transistor is connected to one terminal of the second transistor, the other terminal of the second transistor is connected to the bit line, and the one terminal and the other terminal of the first transistor are charged before data is read from the memory cell.

Resistance change type memory

According to one embodiment, a semiconductor memory device comprises a first bank and a second bank. Each of the first bank and the second bank comprises a memory cell having a variable resistor element, a reference cell, a sense amplifier having a first input terminal electrically coupled to the memory cell and a second input terminal electrically coupled to the reference cell, and a first transistor electrically coupling the memory cell and the first input terminal of the sense amplifier. A gate of the first transistor of the first hank and a gate of the first transistor of the second bank are independently supplied with a voltage.

A resistance change memory including a memory cell having a resistance change element; a reference voltage generating circuit which generates a reference adjustment voltage; a first transistor which has a source and a drain, the drain providing a reference current in accordance with the reference adjustment voltage; and a sense amplifier which compares a cell current flowing through the memory cell with the reference current flowing through the first transistor. The reference voltage generating circuit includes a second transistor having a gate coupled to a gate of the first transistor, the reference adjustment voltage changing in accordance with a temperature, and the first transistor is an n-channel MOS transistor, and operates in a linear region which changes in a current value in accordance with the reference adjustment voltage.

Resistance change memory

According to one embodiment, a semiconductor memory device includes a variable resistance element configured to store data '0' and data '1' in accordance with a change in resistance value, a current generator configured to generate a reference current for determining data of the variable resistance element, and having an admittancemiddleat a level inbetween an admittance of a variable resistance element storing data &#x201c;0&#x201d; and an admittance of a variable resistance element storing data &#x201c;1&#x201d;, and a sense amplifier includes a first input terminal connected to the variable resistance element and a second input terminal connected to the current generator, and configured to compare currents of the first input terminal and the second input terminal.

Semiconductor memory device with variable resistance element

According to an embodiment, a magnetic storage device includes a semiconductor region including a trench; a gate electrode disposed in the trench; an insulation film covering the gate electrode and provided in a manner to fill the trench; and a magnetoresistive effect element including at least a first ferromagnetic layer, a second ferromagnetic layer, and a non-magnetic layer provided between the first ferromagnetic layer and the second ferromagnetic layer, the non-magnetic layer in a side surface of the magnetoresistive effect element including the non-magnetic layer being provided on a top surface of the insulation film.

Magnetic storage device

According to one embodiment, a variable change memory includes a bit line, a word line, a memory cell array, a resonance line, a clock generator, and a write driver. The bit line extends in a first direction. The word line extends in a second direction. The memory cell array includes blocks. The each block includes memory cells including a transistor and a variable resistive element. The resonance line connects to a bit line. The clock generator is arranged in the memory cell array and applies a voltage to the resonance line. The write driver supplies a write current to the bit line. The voltage oscillates at the predetermined period and the write current are supplied to the bit line.

Variable change memory and the writing method of the same

According to one embodiment, a resistance change memory includes a memory cell, a reference voltage generating circuit, a first transistor and a sense amplifier. The memory cell includes a resistance change element. The reference voltage generating circuit generates a reference adjustment voltage. The first transistor provides a reference current in accordance with the reference adjustment voltage. The sense amplifier compares a cell current flowing through the memory cell with the reference current flowing through the first transistor.

According to one embodiment, a semiconductor memory device includes a memory cell; a reference signal generation circuit; a sense amplifier; a first transistor configured to electrically couple the memory cell and a first input terminal of the sense amplifier; a second transistor configured to electrically couple the reference signal generation circuit and a second input terminal of the sense amplifier; a first control circuit configured to supply a voltage to gates of the first transistor and the second transistor; a second control circuit configured to supply a first voltage except 0V to a back gate of the first transistor; and a third control circuit configured to supply a second voltage except 0V to a back gate of the second transistor.

Semiconductor memory device for sensing memory cell with variable resistance

A resistance change memory includes a memory cell array comprising memory cells including magnetic tunnel junction (MTJ) elements; a write and read circuit which performs a write operation and a read operation for the memory cells; a temperature sensor which outputs temperature information corresponding to a temperature of the memory cell array; and a memory controller which controls the write operation and the read operation by the write and read circuit in response to the temperature information, such that a first time period from a write command input to a pre-charge command input is variable according to the temperature information, while a second time period from an active command input to the pre-charge command input is fixed constant regardless of the temperature information.

According to one embodiment, a semiconductor memory device includes first word lines connected to a memory cell array, second word lines connected to a redundancy area, a first row decoder configured to perform selecting from the first word lines based on a row address, a judgment circuit configured to determine whether or not a replacement operation with the redundancy area is needed based on a redundancy address included in the row address, and a second row decoder configured to perform selecting from the second word lines. The row address includes a first row address and a second row address input in order in a time-sharing method. The first row address includes all of the redundancy address.

A semiconductor storage device according to the present embodiment includes a plurality of memory units respectively comprising a plurality of memory cells. A data bus is shared by the memory units and transfers data from the memory units or to the memory units. A timing controller includes a delay time unit shared by the memory units sharing the data bus. The timing controller is configured to output a control signal for driving the memory units after a predetermined delay time elapses since receiving an input signal.

Timing controller with delay time units for a semiconductor storage device

According to one embodiment, a resistance change memory comprises a memory cell array, a write and read circuit, a temperature sensor, and a memory controller. The memory cell array comprises memory cells including magnetic tunnel junction (MTJ) elements. The write and read circuit performs a write operation and a read operation for the memory cells. The temperature sensor outputs temperature information corresponding to a temperature of the memory cell array. The memory controller controls the write operation and the read operation by the write and read circuit in accordance with the temperature information.

According to one embodiment, a semiconductor memory device includes a memory cell array, a buffer configured to hold data input to an input/output circuit and to hold data read from the memory cell array, and a controller configured to receive a first command and an address from the outside and to read data, in response to the first command, from a memory cell group coupled to a selected word line designated by the address to the buffer. The controller receives a second command which is input after the first command and indicates a last command of a group of commands including write commands and/or read commands, and starts a write operation from the buffer to the memory cell array in response to the second command.

Growing community of inventors

Yokohama, Japan

Katsuyuki Fujita