Dexerials Corporation

Katsuyuki Ebisawa

Tomoyuki Ishimatsu

Hironobu Moriyama

Hidekazu Yagi

Keiji Honjyo

Junichi Kaneko

A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3):&#x2003;&#x2003;(1)&#x2003;&#x2003;(2)()/()&#x2264;1.4E+06 Pa.&#x2003;&#x2003;(3)Ga represents a shear storage modulus of the first thermoplastic resin layer at a pasting temperature at which the protective tape is pasted; Gb represents a shear storage modulus of the second thermoplastic resin layer at the pasting temperature at which the protective tape is pasted; Ta represents a thickness of the first thermoplastic resin layer; and Tb represents a thickness of the second thermoplastic resin layer.

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Tochigi, Japan

Katsuyuki Ebisawa