Seiko Epson Corporation

Katsuyoshi Onodera

Norihiro Masuda

Toshio Kumagai

Yoshihiro Kobayashi

Kazutoshi Shimizu

There is provided a liquid discharging apparatus which includes a discharge head that includes a nozzle forming surface on which nozzles for discharging liquid are formed; a wiping member that performs wiping by relatively moving on the nozzle forming surface while abutting on the nozzle forming surface; a cleaning liquid supply unit that supplies cleaning liquid provided for the wiping; and a control unit that performs reciprocating wiping control which performs the wiping by causing the wiping member for holding the cleaning liquid supplied from the cleaning liquid supply unit to perform a reciprocating operation in which, after relative movement is performed in a first direction along the nozzle forming surface, relative movement is performed in a second direction which is opposite to the first direction.

Liquid discharging apparatus and method of cleaning discharge head

There is provided a head cleaning method in a liquid discharging apparatus which includes a head, a storage section that stores liquid, a circulation flow path that includes a first flow path which supplies the liquid from the storage section to the head and a second flow path which refluxes the liquid from the head to the storage section, a circulation pump, and a wiping section. The head cleaning method includes: a first step of setting a flow rate per unit time of the liquid which flows through the circulation flow path to a first flow rate which is greater than a flow rate in a case in which the liquid is discharged to the recording medium; a second step of the wiping section performing the wiping process after the first step; and a third step of setting the flow rate per unit time of the liquid which flows through the circulation flow path to a second flow rate which is lower than the first flow rate after the second step.

Head cleaning method and liquid discharging apparatus

In a liquid discharging apparatus that includes a circulation flow path, a head cleaning method includes a first process in which a flow rate of the liquid flowing through the circulation flow path per unit time is set at a first flow rate; a second process in which, after the first process is completed, a wiping unit carries out a wiping operation in a state where the liquid is discharged from the nozzle; a third process in which, after the second process is completed, the wiping unit carries out the wiping operation in a state where the liquid is not discharged from the nozzle; and a fourth process in which, after the third process is completed, a flow rate of the liquid flowing through the circulation flow path per unit time is set at a second flow rate that is lower than the first flow rate.

There is provided a liquid discharging apparatus which includes: a discharge head that includes a nozzle forming surface on which nozzles for discharging liquid are formed; a wiping member that performs wiping by relatively moving on the nozzle forming surface in a state in which a wiping surface abuts on the nozzle forming surface; a cleaning liquid supply unit that supplies cleaning liquid to a liquid supplied surface which is a different surface from the nozzle forming surface and with which the wiping surface can come into contact; and a control unit that causes the wiping surface to abut on the liquid supplied surface to which the cleaning liquid is supplied, and then causes the wiping surface to relatively move on the nozzle forming surface in a state in which the wiping surface abuts on the nozzle forming surface.

Liquid discharging apparatus and method for cleaning discharge head

A method for manufacturing a thin-film device includes forming a separation layer on a substrate, forming a support layer of mainly clay containing silicate mineral having a layered crystal structure on the separation layer, forming a thin-film functional member on the support layer, applying an energy to the separation layer to reduce the adhesion between the substrate and the support layer, and removing the substrate from the support layer and the thin-film functional member.

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Chino, Japan

Katsuyoshi Onodera