Kioxia Corporation

Toshiba Memory Corporation

Elpida Memory, Inc.

Katsuyoshi Komatsu

Tadaomi Daibou

Hiroki Kawai

Takeshi Iwasaki

Yuichi Ito

Hiroki Tokuhira

Hiroshi Takehira

Masatoshi Yoshikawa

Atsuko Sakata

Takeshi Ishizaki

Hiroyuki Ode

Koji Mine

Shogo Itai

Ryohei Kitao

Jieqiong Zhang

Takanori Usami

Yosuke Matsushima

A semiconductor memory device includes a first wiring extending in a first direction; a second wiring extending in a second direction and spaced from the first wiring in a third direction; a stacked body disposed between the first and second wirings and including conductive layers and insulating layers alternately stacked on top of one another in the third direction; a columnar body extending through the stacked body and including: (a) an electrode disposed between the first wiring and the second wiring, (b) a memory layer disposed between the electrode and the conductive layers, and (c) a selection layer disposed between the electrode and the first wiring; and a diode disposed between the electrode and the second wiring.

Semiconductor memory device

According to one embodiment, a magnetic memory device includes a magnetoresistance effect element including first and second magnetic layers each having a fixed magnetization direction, a third magnetic layer provided between the first and second magnetic layers, and having a variable magnetization direction, a first nonmagnetic layer between the first and third magnetic layers, and a second nonmagnetic layer between the second and third magnetic layers, and a switching element connected in series to the magnetoresistance effect element, changing from an electrically nonconductive state to an electrically conductive state when a voltage applied between two terminals is higher than or equal to a threshold voltage.

Magnetic memory device including magnetoresistance effect element

A switching device according to an embodiment includes a switching layer disposed between a first electrode and a second electrode. The switching layer contains a material containing a first cation element Z, Te, and N. This material contains at least 5 atomic % or more of each of Z, Te, and N, and when an atomic ratio of Te is X, an atomic ratio of N is Y, an atomic ratio of Z is W, a ratio of ZTeto ZN on a straight line connecting a compound of the first cation element Z with tellurium and nitride of the first cation element Z in a ternary phase diagram of Z, Te, and N is A, and a change in an N content from the ZTe—ZN line is B, the material has a composition satisfying X=1.2 (1−A) (0.5+B), Y=A (0.5+B), and W=1−X−Y, where −0.06≤B≤0.06 is satisfied when ⅓>A and ¾<A, and −0.06≤B and Y≤0.45 are satisfied when ⅓≤A≤¾.

Switching device and resistance variable device

A semiconductor memory device includes a first electrode and a second electrode, a phase change layer disposed between the first electrode and the second electrode, and a first layer disposed between the first electrode and the phase change layer. The phase change layer contains at least one of germanium (Ge), antimony (Sb), and tellurium (Te). The first layer contains aluminum (Al) and antimony (Sb), or tellurium (Te) and at least one of zinc (Zn), lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), and lutetium (Lu).

Semiconductor memory device with a phase change layer and particular heater material

A resistance variable device of an embodiment includes a stack arranged between a first electrode and a second electrode and including a resistance variable layer and a chalcogen-containing layer. The chalcogen-containing layer contains a material having a composition represented by a general formula: C1C2A, where C1 is at least one element selected from Sc, Y, Zr, and Hf, C2 is at least one element selected from C, Si, Ge, B, Al, Ga, and In, A is at least one element selected from S, Se, and Te, and x, y, and z are numbers representing atomic ratios satisfying 0&#x3c;x&#x3c;1, 0&#x3c;y&#x3c;1, 0&#x3c;z&#x3c;1, and x+y+z=1, and when an oxidation number of the element C1 is set to a, and an oxidation number of the element C2 is set to b, the atomic ratio x of the element C1 satisfies x&#x2264;(3&#x2212;(3+b)&#xd7;y&#x2212;z)/(3+a).

Resistance variable device with chalcogen-containing layer

A storage device includes a first conductor, a second conductor, a variable resistance layer, a first portion, and a second portion. The variable resistance layer connects with the first conductor or the second conductor. The first portion is provided between the first conductor and the second conductor, and has a first threshold voltage value at which the resistance value changes. The second portion is provided between the first conductor and the first portion and/or between the second conductor and the first portion, and has a second threshold voltage value at which the resistance value changes and which is higher than the first threshold voltage value.

Storage device

A semiconductor storage device is disclosed. The device includes: a first conductive layer; a second conductive layer apart from the first conductive layer in a first direction; a variable resistance layer provided between the first conductive layer and the second conductive layer; a third conductive layer provided between the first conductive layer and the variable resistance layer; a nonlinear layer provided between the first conductive layer and the third conductive layer; and a first insulating layer provided at least between the first conductive layer and the nonlinear layer or between the third conductive layer and the nonlinear layer. The first insulating layer includes nitrogen (N) and boron (B).

Semiconductor storage device including hexagonal insulating layer

A storage device according to embodiments includes a first conductive layer; a second conductive layer; a resistance change element provided between the first conductive layer and the second conductive layer; and an intermediate layer provided in any one of a position between the resistance change element and the first conductive layer and a position between the resistance change element and the second conductive layer, the intermediate layer containing at least one element of silicon (Si) and germanium (Ge), tellurium (Te), and aluminum (Al).

A semiconductor device may include, but is not limited to, first and second memory regions, and first to fifth control circuits. The first and second memory regions are mutually exclusive at the same time. The first control circuit performs a first access to the first memory region. The second control circuit performs a second access to the second memory region. The third control circuit controls activation and deactivation of the first and second control circuits based on a first logic received from a plurality of first external terminals. The fourth control circuit switches between the first and second accesses based on at least a second logic received from a second external terminal. The fifth control circuit controls validation and invalidation of the fourth control circuit.

Growing community of inventors

Yokkaichi Mie, Japan

Katsuyoshi Komatsu