Hitachi, Ltd.

Katsuyasu Nishita

Yoshifumi Ogawa

Katsuyoshi Kudo

Katsuaki Nagatomo

Hideji Yamamoto

Herein disclosed are a plasma treating method and an apparatus therefor. The plasma treating method comprises: the step of monitoring the energies of plasmas corresponding to the faces of a plurality of samples to be treated; the step of adjusting to equalize the energies of said plasmas on the basis of the monitored values; and the step simultaneously treating said samples with the plasmas having said equalized energies. The plasma treating apparatus comprises: a plurality of sample electrodes disposed independently of one another in positions opposed to an opposed electrode in a treating chamber evacuated to be supplied with a treating gas; power supply means for applying and adjusting electric power to said sample electrodes; and monitor means for monitoring the energies of plasmas to be generated between said opposed electrode and said sample electrodes. The electric power to be applied independently of one another from a power supply to the independently formed plural sample electrodes are adjusted such that the energies of the plasmas to be generated between the opposed electrode and the sample electrodes are equalized, whereby the energy of the plasma corresponding to the respective treated faces of the plural samples are equalized so that the uniformity of the treatment of the respective faces of the plural samples to be simultaneously treated can be improved.

Growing community of inventors

Kudamatsu, Japan

Katsuyasu Nishita