Kagoshima University

Molex Corporation

Fuchigami Micro Co., Ltd.

Molex Japan Co., Ltd.

Katsuya Tsuruta

Kenji Ohsawa

Kei Mizuta

Toshiaki Kotani

Masamichi Ishihara

Rinkou Fukunaga

A cooling device is disclosed. The cooling device includes a thermal diffusing unit operable to radiate heat taken from a heating element, and a heat transporting part, laminated in a thickness direction of the heat diffusing unit and diffused thereby. The thermal diffusing unit has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. The heat transporting part has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. Either the upper plate or the lower plate is formed with the same member of the lower plate or the upper plate of the heat transporting part.

Cooling device and electronic device

A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.

Heat sink package and method of manufacturing

A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.

Heat sink, cooling module and coolable electronic board

A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.

Heat pipe and circuit board with a heat pipe function

A thin and flat type heat pipe with enhanced conductivity. Between an upper memberhaving a rectangular areaon a lower surface and a lower memberhaving a rectangular areaon an upper area are provided intermediate plate members. The membersare each formed with slits, constructing a vapor path extending a planar direction, communicating with the rectangular areasof the members, respectively. Thus, a sealed space is defined by the slitsand the rectangular areasso that a refrigerant is enclosed in the sealed space. Capillary holesare formed through non-slitted portions of the intermediate plate membersso that each capillary holeserves as a capillary path of flow extending vertically to communicate with the rectangular areasof the members

Growing community of inventors

Kagoshima, Japan

Katsuya Tsuruta