Kaneka Corporation

Nichia Corporation

Katsuya Ouchi

Manabu Tsumura

Katsuyu Wakabayashi

Masafumi Kuramoto

Tomohide Miki

Masahito Ide

Tadashi Kokubo

Shuhei Ozaki

Takahisa Iwahara

Tomokazu Tozawa

Kazuhiko Hirabayashi

Hiroshi Okoshi

Kazunori Yokoyama

Noriko Matsushita

Yoshikatsu Ichiryu

Ikuya Nii

Takayuki Miyoshi

Taisuke Sasaki

Michinori Tsukamoto

Harumi Sakamoto

Provided is an organic EL panel. A first conductive film, an organic functional film, a second conductive film, and a sealing film are provided on a substrate. The first conductive film includes a first main body, a first electrode pad, and a second electrode pad. The second conductive film includes a second main body, and a second electrode pad region extending from the second main body toward the first vertex. The second electrode pad region extends to a stretched region exposed from the sealing film which covers a light-emitting region. A first electrode conduction path surrounds at least half of the light-emitting region and connects the electrode pads. A circuit board is fixed near the first vertex. A first electrode wire is configured to adhere to the electrode pads. A second electrode wire is configured to adhere to the second electrode pad region in the stretched region.

Organic EL panel

The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode

An object of the present invention is to provide a curable composition made mainly of an organic polymer having a reactive silicon group, exhibits a good curability without using any organic tin compound substantially, and gives a cured product having a sufficient strength; and to provide a catalyst composition. The object is solved by a curable composition, comprising a polymer (A) having a silicon-containing group which can be crosslinked by forming a siloxane bond, and a fluoride salt compound (B).

Curable composition and catalyst composition

An object of the present invention is to provide a curable composition which is made mainly of a polymer having one or more reactive silicon groups, has good curability even when filler is used while a non-organotin catalyst is used, and is further high in industrial practicability. The object is solved by a curable composition, comprising, as constituents, a polymer (A) having one or more reactive silicon groups on average per molecule thereof, the reactive silicon group(s) being (each) a group which can be crosslinked by forming a siloxane bond, a Lewis acid and/or derivative thereof (B), an amine compound (C), a compound (D) having a reactive silicon group, and filler (E), and obtained by mixing the constituents with each other.

Curable composition

Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same. Disclosed is a modified polyorganosiloxane compound having two or more epoxy group and/or oxetanyl group in a molecule, the compound being a hydrosilylation reaction product of the following compounds:

A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components or which contains a thermosetting resin and an inorganic member as essential components is provided. A curable composition and light-shielding paste comprising the composition are provided which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member. The curable composition can further contain (G) silica. Also provided is a method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls. The curable composition is excellent in light-shielding ability.

Curable composition and method of preparing same, light-shielding paste, light-shielding resin and method of forming same, light-emitting diode package and semiconductor device

The invention aims at a curing agent, curable compositions or compositions for optical materials, capable of providing for cured artifacts having laudable heat resistance, optical transparency, and light resistance; optical materials and methods for their production; and liquid crystal displays and LED's made by using the materials. A curing agent, which comprises at least two SiH groups, is obtainable by subjecting an aliphatic organic compound (&#x3b1;1) and an acyclic and/or cyclic polyorganosiloxane (&#x3b2;1) to hydrosilylation reaction. The curing agent is also obtainable by subjecting an organic compound (&#x3b1;2) and a cyclic polyorganosiloxane (&#x3b2;2) to hydrosilylation reaction.

Curing agent, curable compositions, compositions for optical materials, optical materials, their production and liquid crystal displays and LED's made by using the materials

A curable composition comprising: component (A), which is an aliphatic organic compound including at least two carbon-carbon double bonds within one molecule, the at least two carbon-carbon double bonds having reactivity with an SiH group; component (B), which is a compound including at least two SiH groups within one molecule; and component (C), which is a hydrosilylation catalyst. The curable composition can be made into an optical material by being previously mixed so as to allow the carbon-carbon double bonds having reactivity with an SiH group to react with some or all of the SiH groups in the composition, thereby causing curing. There is provided a curable composition having a high heat-resistance, a low birefringence, a small coefficient of photoelasticity, a high optical transparency, and toughness; an optical material; a method for producing the same; and a liquid crystal display device incorporating the same.

Curable composition, composition for optical material, optical material, liquid-crystal display device, transparent conductive film, and process for producing the same

The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.

Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product

This invention is a method for the production of a cyclic oligosiloxane, which comprises heating a linear or cyclic polysiloxane in the presence of a metal alkoxide, by which the cyclic oligosiloxane can be produced with high yield by a method having industrially high practical value, because it can carry out the reaction under moderate conditions without causing gelation of the reaction system, in comparison with conventional methods using an alkaline or acidic catalyst.

Growing community of inventors

Settsu, Japan

Katsuya Ouchi