Sumitomo Wiring Systems, Limited

Kabushiki Kaisha Toshiba

Pacific Engineering Corporation

Tokai Electric Wire Company, Ltd.

Katsuya Ito

Junji Muta

Hiroaki Tsunoda

Takanori Matsumoto

Manabu Ohta

Makoto Hasegawa

Fumiyoshi Tanigawa

Katsuhiro Ishida

Hideki Shibata

Hiroshi Sugiura

Hitoshi Takanashi

Kouichi Shirouzu

Shinshu Kato

Toshihisa Sekido

Takayuki Taniguchi

Tsuyoshi Sakita

Takato Fujiki

Shinichi Yamada

Takeshi Nozaki

Akira Hirata

An electrical junction box can include a case, a substrate connector, and a substrate. The substrate is temporarily fixed and soldered to the substrate connector. The substrate connector and the substrate are stored in the case. The substrate connector includes a pair of shaft-shaped temporary fixing protrusions. Each of the temporary fixing protrusions includes a positioning shaft that positions the substrate and a temporary fixing shaft that prevents the temporary fixing protrusions from coming loose from the substrate. The temporary fixing protrusions can be fitted into fitting holes in the substrate.

Electrical junction box

A printed circuit board with a terminal having a novel structure that enables terminals to stand on their own on the printed circuit board without using a seat, while reducing or eliminating damage to through-hole plating or an inner layer circuit. A printed circuit board with a terminal includes a terminal having soldering sections that are inserted, without being press-fitted, into through-holes of a printed circuit board and are fixed by soldering. The terminal has a fixation leg and the printed circuit board has a press-fit hole, the terminal is positioned and retained on the printed circuit board by the fixation leg of the terminal being press-fitted into the press-fit hole of the printed circuit board, and an inner circumferential surfaces of the through-holes are provided with plating, whereas an inner circumferential surface of the press-fit hole is not provided with the plating.

Printed circuit board having a terminal with a fixation leg and a soldering section

A casing includes a first casing member and a second casing member. The first casing member is provided on a side with a fuse module mounting section having a side opening. The second casing member is provided on the same side as the first casing member with a relay module mounting section having a side opening and extending downward. An ECU mounting frame extends from a bottom wall of the second casing member. An ECU is disposed on a second side of a bottom wall of the second casing member and in parallel with the relay module mounting section. A fuse module is attached to the fuse module mounting section to receive fuses. A relay module is attached to the relay module mounting section to receive relays. The fuse module and relay module that generate heat are disposed on a side of the casing in a vertical direction.

Vehicle-mounted electrical junction box

A semiconductor device includes a semiconductor substrate, a lower wiring layer formed on the semiconductor substrate, a first interlayer insulating film formed on the lower wiring layer and including a first upper surface and a second upper surface, the first upper surface being higher than the second upper surface relative to a surface of the semiconductor substrate, a contact plug formed in the interlayer insulating film and including a first bottom surface contacting to the lower wiring layer, a third upper surface flush with the second upper surface and a fourth upper surface flush with the first upper surface, an upper wiring layer formed on the first and third upper surfaces and including a first side surface and a second side surface opposite to the first side surface, and a second interlayer insulating film formed on the second and fourth upper surfaces.

Semiconductor device having multilayer wiring structure

A fusible link unit includes a bus bar adapted to be connected to a battery without interposing a fuse between the bus bar and the battery, and a heat resistant insulating sheet which covers at least an upper edge portion of the bus bar. The fusible link unit is adapted to be accommodated inside an in-vehicle electrical connection box.

Fusible link unit accommodated in in-vehicle electrical connection box

A semiconductor device such as a flash memory includes a semiconductor substrate having a surface, and a plurality of trenches formed in the substrate so as to be open at the surface of the substrate, the trenches having opening widths different from each other. The trench with a smaller opening width is formed so as to have a first depth and the trench with a larger opening width has a bottom including opposite ends each of which has a second depth deeper than the first depth and a central portion shallower than the second depth.

Method of fabricating semiconductor device with STI structure

A semiconductor device includes a semiconductor substrate including a memory cell region and a peripheral circuit region, a first trench formed in the memory cell region and having a first depth and a first opening width, and a second trench formed in the peripheral circuit region and including a pair of bottom edge portions and a bottom middle portion located between the bottom edge portions. The second trench has a second opening width that is larger than the first opening width. Each bottom edge portion has a second depth that is larger than the first depth. The bottom middle portion has a third depth that is same as the first depth.

Semiconductor device with STI structure

An electrical junction box includes a printed board, a broad bus bar for a power source circuit, a plurality of output side connecting terminal members, and a casing for containing the printed board, broad bus bar, and terminal members. A plurality of fuses are mounted on fuse-containing sections in parallel with one another. The broad bus bar for a power source circuit has a vertical portion and a horizontal portion extending from an upper end of the vertical portion to form an inverted L-shaped configuration. The output side connecting terminal members are disposed in a space covered with the broad bus bar. The broad bus bar is provided with a window so that a soldered condition of the output side connecting terminal members can be seen through the window.

Electrical junction box for motor vehicle

Fuse

A method of fabricating a semiconductor device includes forming a lower wiring layer on a semiconductor substrate, forming an interlayer insulating film on the lower wiring layer, layer, forming a plurality of. contact plugs in the interlayer insulating film so that the contact plugs are brought into electrical contact with the lower wiring layer, thereby forming an interlayer wiring layer, forming an upper wiring, layer on the interlayer wiring layer so that the upper wiring layer is brought into electrical contact with the contact plugs, and patterning the upper wiring layer so that the upper wiring layer corresponds to the contact plugs. In the patterning, after the upper wiring layer has been etched, the exposed interlayer insulating film and the exposed contact plugs are etched.

Method of fabricating semiconductor device having multilayer wiring structure

A method of fabricating a semiconductor device, includes depositing, on a semiconductor substrate, a gate insulating film, a polycrystalline or amorphous silicon film, a silicon nitride film and a silicon oxide film sequentially, patterning a resist for forming a plurality of trenches on an upper surface of the substrate so as to have opening widths differing from each other, etching the silicon oxide film and the silicon nitride film formed on the substrate by an reactive ion etching (RIE) process with the resist serving as a mask, and etching the polycrystalline or amorphous silicon film, the gate insulating film and the substrate by the RIE process with the etched silicon oxide film and silicon nitride film serving as a mask using reactive plasma including a halogen gas, fluorocarbon gas, Ar and O2, thereby simultaneously forming the trenches with opening widths differing from each other.

A junction box comprises small size standard boxes. The small size standard box includes a main casing that contains many longitudinal bus bars disposed in parallel with one another at a given interval in distance therein, and male and female coupling portions provided on the outer opposite side surfaces of the main casing. Plural small size standard boxes are juxtaposed together in accordance with different kinds of automobile vehicles by interconnecting the male and female coupling portions successively. A lower casing member is attached to the main casing. The size of the lower casing member depends on the number of the standard boxes to be coupled for a special purpose. The lower casing member is provided with an attachment portion for a vehicle body projecting from the member.

Junction box having a plurality of main casings and connectors designed for use with different types of automobiles

A connecting structure between a junction box and an electrical component connector block that prevents material failure of the connecting structure. The junction box and connector block, which includes receptacles for components on an upper surface thereof, are adjacently connected by joint structure formed between mutually facing external sidewalls of the junction box and connector block. A hook portion, which is formed as an integral component of the connector block, connects to the upper edge of a sidewall of junction box when the connector block is joined to the junction box. This structure prevents the load applied by the insertion of components into a receptacle of the connector block from being concentrated at a single point, and thus prevents material failure of the connecting structure.

Joining structure for junction box and electrical component connector block

A connecting structure between an adjacently aligned junction box and electrical component connector block includes a connector block having an insertion bracket around which a channel or groove is formed at an insertion bracket base portion. This channel or groove is configured such that the point of material failure or fracture occurs on the connector block in the event that the connecting structure is subject to a large externally induced load.

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Yokkaichi, Japan

Katsuya Ito