Nec Corporation

Cbc Co., Ltd.

Sumco Corporation

Kyb Corporation

Uacj Extrusion Corporation

Katsuya Hirano

Takeshi Nakatani

Kazuhiro Chiba

Masashi Hasegawa

Ryuichi Kaneko

Kouichi Takita

Tsunemi Niikura

Mohammad B Shabani

Naoto Ozaki

Kazutaka Shibuya

Yasuhiro Nakai

Tadashi Minoda

Nobuji Yamamoto

A lens device is provided that outputs an action state of a lens while utilizing a multi-purpose communication interface capable of connecting a large number of camera devices. The lens device includes: a lens mechanism that is built into a lens main body and forms the optical image; a drive control unit that is built into the lens main body and drive-controls the lens mechanism; a control unit that includes a microcomputer and outputs a drive control signal to the drive control unit; a first connection unit that forms a first communication interface capable of having input/output communication with the control unit, and is capable of connecting to a network; and a second connection unit that includes a second communication interface capable of outputting a signal from the control unit.

Lens device, lens device embedded system, lens device embedded inspection device, and operation program

A lens device with which a network can be pulled out from a lens main body and connected to an operation terminal is provided. The lens device for capturing an optical image includes: a lens mechanism for forming the optical image, the lens mechanism being built into a lens main body; a drive control unit for drive-controlling the lens mechanism, the drive control unit being built into the lens main body; a central processing unit that outputs a drive control signal to the drive control unit; and a network that forms a power supply interface for the lens main body, and a communication interface for the central processing unit. Thereby, the lens and the operation terminal are connected via the network, so that it is possible to expand the connection mode between the lens and the operation terminal to an n-to-one or n-to-n connection mode.

Lens device

There is provided a zoom lens, consisting of sequentially from an object side: a first lens group having a positive refractive power and a focusing function; a second lens group having a negative refractive power and having a variator function of performing zooming; a third lens group having a positive refractive power and a diaphragm; a fourth lens group having a positive refractive power, and having a compensator function of correcting a position of an imaging plane at the time of zooming; and a fifth lens group having a positive or negative refractive power, wherein the second lens group is moved to the imaging plane side from the object side along an optical axis, and the fourth lens group is moved along the optical axis in a state of fixing the first lens group, the third lens group, and the fifth lens group at the time of zooming from a wide angle end to a telephoto end, and only the first lens group is moved along the optical axis at the time of focusing.

Zoom lens having first through fifth lens groups and a specific focal distance ratio among the lens groups

The present invention has an object of providing an electronic apparatus storing container capable of facilitating mounting of an electronic apparatus and having improved productivity. The electronic apparatus storing container according to the present invention includes: a base including an electronic apparatus mounting area of a planar shape in which an electronic apparatus is mountable, and a packing groove formed in an outer peripheral portion of the electronic apparatus mounting area; a waterproof packing fit in a corresponding manner in the packing groove; and a case joined with the base with the waterproof packing sandwiched therebetween, the case storing the electronic apparatus mounted in the electronic apparatus mounting area. This improves the productivity of the electronic apparatus storing container.

Electronic apparatus storing container and method for assembling electronic apparatus storing container

This method for assaying copper in silicon wafers includes the steps of: forming a polysilicon layer on the surface of a p-type silicon wafer having the same characteristics as the silicon wafers being assayed; heat treating the p-type silicon wafer after it has been polished; dissolving the polysilicon layer on the heat-treated p-type silicon wafer with a mixed acid composed of at least hydrofluoric acid and nitric acid; and quantitatively determining the copper components within the mixed acid following dissolution of the polysilicon layer.

Method for assaying copper in silicon wafers

Wireless communication terminal

A cooling apparatus is disclosed for cooling and dehumidifying the inside of a device such as an electronic device installed outdoors The cooling apparatus of the invention comprises a set of dehumidifying parts, each arranged at an open air intake side and an air exhaust side of a housing of the device respectively, and having filtering members for removing humidity from the open air. When air in the housing is saturated with humidity by air blowing from a fan, the rotational direction of the fan is reversed to thereby change the air flowing direction towards the dehumidification part. A dehumidification material thus receives heated and dried exhaust-air from a heating material and discharges moisture accumulated within the material to the outside, thereby recovering moisture absorption capability of the dehumidification material.

Cooler using filter with dehumidifying function

A hermetic enclosure having an air pressure adjustable function, which can adjust inside air pressure of the hermetic enclosure, is provided. In order to prevent devices in the hermetic enclosure from corroding, the hermetic enclosure having an air pressure adjustable function provides a main body having a clearance part and a packing fixing groove, a door, and packing that is fixed to the packing fixing groove of the main body. And the door is jointed with the main body by placing the packing between the door and the main body in a state that the door is able to slide on the packing. And when inside and outside air pressure of the hermetic enclosure becomes different, the door moves on the packing and the clearance part of the main body is changed, and the inside and outside air pressure is adjusted to be almost equal.

Growing community of inventors

Tokyo, Japan

Katsuya Hirano