Hitachi Cable, Inc.

Katsutoshi Taga

Mamoru Mita

Hiroki Tanaka

Norio Okabe

Akira Chinda

Takashi Kageyama

Hiroshi Ishikawa

Yasuharu Kameyama

Akira Matsuura

Takayuki Sato

Takayuki Yoshiwa

A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided with an opening having predetermined pattern, a wiring formed with predetermined pattern on said insulating board, and an external terminal filled to said opening, connected with said wiring by said filling, and exposed to a bottom of said insulating board where said wiring is formed.

Wiring board, method for manufacturing wiring board and electronic component using wiring board

A method of manufacturing a double-sided circuit tape carrier comprising an insulating film like a polyimide tape, circuit wiring patterns on both sides thereof, and via holes through which at least a part of the circuit wiring patterns on both sides are electrically connected with each other. A copper thin film is patterned by photoetching. Via holes are formed through the insulating film by irradiating a laser beam by using the patterned copper thin film as a mask. Then, a conductive layer of a graphite conductive thin film and a copper plating layer is formed. The copper thin film is patterned by photoetching forming a chip hole and an outer lead hole through the insulating film by irradiating a laser beam. Finally, one of the copper thin films is patterned by photoetching to form circuit wiring pattern.

Method of manufacturing double-sided circuit tape carrier

Growing community of inventors

Tokyo, Japan

Katsutoshi Taga