Ebara Corporation

Hoya Corporation

Showa Denko K.k.

Sony Corporation

Nippon Light Metal Company, Ltd.

Katsutoshi Ono

Yoichi Kobayashi

Toshifumi Kimba

Itsuki Kobata

Masaki Kinoshita

Hiroyuki Sakai

Tomomitsu Kato

Syoji Matsuda

Kazuhiko Maeda

Tsuneo Kusunoki

Toru Maruyama

Hisanori Matsuo

Kuniaki Yamaguchi

Jun Ozawa

Kinobu Osakabe

Tomohiko Abe

Yu Ishii

Yasuyuki Motoshima

Tadakazu Sone

Shinji Eda

Yoichi Shiokawa

Ryosuke Suzuki

Yasumasa Hiroo

Nobuyuki Eto

Koji Takahashi

Yuichi Kimizuka

A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

Polishing apparatus

A composition is provided which includes a polymerizable compound (A) which includes a (meth)acryloyl group and an isocyanate group in a molecule thereof; and a reaction accelerator (B) which is a compound including a (meth)acryloyl group and a halogenated carbamoyl group in a molecule.

Composition, curable composition, production method therefor, and cured product

A reaction accelerator is provided which is used in a reaction of a compound including an isocyanate group that is not directly bonded to an aromatic ring in a molecule with a compound including an active hydrogen-containing group and is formed of a compound including a halogenated carbamoyl group. A production method is provided which includes reacting a compound including an isocyanate group that is not directly bonded to an aromatic ring in a molecule with a compound including an active hydrogen-containing group to produce a urethane compound, a thiourethane compound, an amide compound or a urea compound, in which the reaction is performed in the presence of the reaction accelerator.

Reaction accelerator and method of producing urethane compound, thiourethane compound, amide compound, or urea compound using same

The present invention provides an apparatus and a method for polishing a substrate having a film formed thereon. The method includes: rotating a polishing table supporting a polishing pad by a table motor; pressing the substrate against the polishing pad by a top ring; obtaining a signal containing a thickness information of the film; producing from the signal a polishing index value that varies in accordance with a thickness of the film; monitoring a torque current value of the table motor and the polishing index value; and determining a polishing end point based on a point of time when the torque current value has reached a predetermined threshold value or a point of time when a predetermined distinctive point of the polishing index value has appeared, whichever comes first.

Polishing apparatus and polishing method

A polishing apparatus for polishing a substrate includes a polishing table holding a polishing pad, a top ring configured to press the substrate against the polishing pad, and first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate. The polishing apparatus also includes spectroscopes each configured to measure at each wavelength an intensity of the reflected light received, and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.

Polishing method

An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatus

This invention relates to a method and an apparatus for smelting titanium metal by the thermal reduction of titanium oxide (TiO) to titanium metal (Ti); a mixed salt of calcium chloride (CaCl) and calcium oxide (CaO) contained in a reaction vessel is heated to form a molten salt which constitutes a reaction region, the molten salt in the reaction region is electrolyzed thereby converting the molten salt into a strongly reducing molten salt containing monovalent calcium ions (Ca) and/or calcium (Ca), titanium oxide is supplied to the strongly reducing molten salt and the titanium oxide is reduced and the resulting titanium metal is deoxidized by the monovalent calcium ions and/or calcium. The method and the apparatus make it feasible to produce commercially titanium metal suitable for a variety of applications from titanium oxide.

Method and apparatus for smelting titanium metal

A polishing apparatus can detect completion of initialization of a polishing pad quantitatively. The polishing apparatus has a polishing table having a polishing pad attached thereto and a substrate holder configured to bring a surface of a substrate into contact with the polishing pad and press the substrate against the polishing pad. The polishing apparatus also has a drive mechanism operable to drive at least one of the polishing table and the substrate holder so as to provide a relative movement between the polishing pad and the substrate. The polishing apparatus includes a current sensor operable to detect a drive current supplied to the driving mechanism. The polishing apparatus also includes a polishing pad condition detector operable to detect a condition of the polishing pad based on the drive current detected by the current sensor when the dummy substrate is polished by a relative movement between the polishing pad and a dummy substrate held by the substrate holder.

In a glass substrate for use in a magnetic recording medium, a surface roughness of at least a principal surface of the glass substrate is measured by the use of the interatomic force microscope (AFM), Ra falls within the range between 0.2 and 2.5 nm, Rmax falls within the range between 3 and 25 nm, and Rmax/Ra falls within the range between 3 and 35.

Glass substrate for magnetic recording medium, magnetic recording medium, and method of manufacturing the same

An object of the present invention is to prevent the dhesion of particles such as fine iron powders onto a glass substrate upon the production of a glass substrate for an information recording medium. To attain the above object, any one of the following means is adopted: (1) at least one of the production, inspection, packing and filling steps of the glass substrate for an information recording medium is carried out under a clean atmosphere which does not permit the adhesion of particles; (2) at least a wall surface of a chemical reinforcement tank containing a chemical reinforcement liquid therein and/or said retaining means which is contact with the chemical reinforcement liquid is formed of a stainless alloy having corrosion resistance in a high-temperature region as high as the heating temperature of the chemical reinforcement liquid; (3) a means for trapping fine particles existing in the chemical reinforcement liquid used in the chemical reinforcement step is provided; and (4) the glass substrate is washed with hydrochloric acid.

Process for producing glass substrate for information recording medium

A green light emitting phosphor comprising tetravalent elements added to a green light emitting phosphor, Y.sub.3 (Al,Ga).sub.5 O.sub.12 :Tb, wherein the green light emitting phosphor can prevent a so-called electron beam burning even when excited by electron beams of high energy. The green light emitting phosphor is, particularly suitable to be applied to a projector tube or a high-brightness phosphor display tube.

Growing community of inventors

Tokyo, Japan

Katsutoshi Ono