Shinkawa Ltd.

Katsutoshi Nomura

Yuichiro Noguchi

A mounting apparatus () serves to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component. The mounting apparatus includes: a film winding mechanism () that rotates a winding reel () to wind in a film spanning from a dispensing reel to the winding reel (), the film winding mechanism () executing the winding so that a new film is disposed on the bottom surface of the mounting head each time when an electronic component is mounted; a tension detecting part () that detects the tension of the film after the same is wound by the film winding mechanism (); and a control part () that rotates the winding reel () by a winding motor () to adjust the tension on the basis of the tension detected by the tension detecting part (). A film supply apparatus is also provided.

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Tokyo, Japan

Katsutoshi Nomura