Rohm Co., Ltd.

Katsutoshi Nagi

Junichi Hikita

Takashi Ueda

Hiroo Mochida

A chip-on-chip-structure semiconductor device for a radio communication device, having a base band chip and a high-frequency chip piled up on and bonded to the surface thereof. The base band chip has a low-frequency signal processing unit for processing a signal in a first frequency band. The high-frequency chip has a high-frequency signal processing unit for processing a signal in a second frequency band of which frequency is higher than that of the first frequency band.

Semiconductor device for radio communication device, and radio communication device using said semiconductor device

In a communication device, electric circuits other than an antenna are enclosed in a shielding member made of a material that shuts off radio waves, and the antenna is enclosed by disposing in front thereof a radio wave absorbing member that attenuates radio waves in a predetermined frequency band. Thus, unnecessary electromagnetic emission is alleviated while satisfactory communication quality is secured.

Growing community of inventors

Kyoto, Japan

Katsutoshi Nagi