Hitachi Chemical Company, Ltd.

Katsutoshi Itagaki

Yoshihiro Watanabe

Takuji Abe

Tomoyuki Haga

Hideaki Tagaya

Naoki Sasahara

Yoshiki Ajioka

Masaki Endou

Masanori Shindou

Takahiro Fukaya

Provided is a photosensitive resin composition, including: a binder polymer; a photopolymerizable compound having an ethylenically unsaturated group; a photopolymerization initiator; a benzotriazole compound; and an aliphatic diamine compound having from 8 to 30 carbon atoms.

Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing wiring board

The invention provides a photosensitive resin composition that can form resists with excellent adhesiveness for conductive layers and that does not easily produce conductive layer discoloration, as well as a photosensitive film employing the composition. A preferred photosensitive film () according to the invention comprises a support (), resin layer () and protective film (), where the resin layer () is composed of a photosensitive resin composition comprising a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a benzotriazole derivative represented by the following general formula (1). [wherein Rand Reach independently represent hydrogen or a monovalent organic group, and Rrepresents a halogen atom, an alkyl, cycloalkyl, allyl, aryl, amino, alkylamino, nitro, cyano, mercapto, alkylmercapto, hydroxyl, hydroxyalkyl, carboxyl, carboxyalkyl, acyl or alkoxy group or a monovalent group with a heterocyclic ring, with the proviso that at least one of Rand Ris an optionally substituted aryl group or an organic group containing a C10 or greater hydrocarbon group.]

Photosensitive resin composition and photosensitive film made with the same

A method of increasing manufacturing efficiency of printed wiring boards is provided that includes packaging a photosensitive film roll with a resin case, wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a supporting film and a photosensitive resin composition layer formed on the supporting film, wherein the photosensitive resin composition layer comprises a photosensitive resin composition that contains a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator, and wherein the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.

Method for packaging a photosensitive film roll, resin case therefor, method for recovering and reusing the case, and photosensitive film roll package and method for conveying the same

A method for packaging a photosensitive film roll, which includes packaging the photosensitive film roll with a resin case. The photosensitive film roll is formed in a step by winding around a core, a photosensitive film comprising a supporting film and a photosensitive resin composition layer formed on the supporting film. The resin case is collapsible without generating any waste materials after the case is collapsed. The photosensitive resin layer includes a photosensitive resin composition containing a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator, and the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.

A photosensitive resin composition is here disclosed which satisfies the following (1) and (2):

Growing community of inventors

Hitachi, Japan

Katsutoshi Itagaki