Nitto-denko Corporation

Katsutoshi Hirashima

Hirofumi Fujii

Masaki Mizutani

Yasushi Tamura

Ryouji Suezaki

Kyouyuu Jo

A negative photosensitive material is provided which has a lower linear expansion coefficient and a lower hygroscopic expansion coefficient and is excellent in gradational patternability and PI etchability in patterning. The negative photosensitive material comprises:  wherein R, R, R, Rand R, which may be the same or different, are each a Cto Calkyl group, and Ar is an aryl group having a nitro group at its ortho position, wherein R, R, Rand R, which may be the same or different, are each a Cto Calkyl group, and Ar is an aryl group having a nitro group at its ortho position.

Negative photosensitive material, photosensitive board employing the negative photosensitive material, and negative pattern forming method

A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises: (A) a cyclic phosphazene compound represented by the following general formula (1): wherein at least one of the Rs is an organic group having the urethane(meth)acrylate structure represented by the following general formula (2) and n is a positive number of 2 to 5: wherein Ris a hydrogen atom or a methyl group;(B) a carboxyl-containing linear polymer obtained by polymerizing an ethylenically unsaturated compound through addition polymerization;(C) an epoxy resin;(D) an ethylenically unsaturated group-containing polymerizable compound; and(E) a photopolymerization initiator;wherein the cyclic phosphazene compound (A) is present in a proportion of 5 to 30 wt % based on the total weight of the composition.

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Ibaraki, Japan

Katsutoshi Hirashima