Kabushiki Kaisha Toshiba

Katsuto Katoh

Kiyomi Naruke

Yoichi Hiruta

Yasuhiro Yamaji

Naohiko Hirano

Tsutomu Nakazawa

Akihiro Mase

Yoshihiro Atsumi

A semiconductor chip is packaged within film carriers which serve as the enclosure of the semiconductor chip. The finished semiconductor device is flexible, bendable, and very thin. In manufacturing this semiconductor device, the process of laminating film carriers, the process of electrically connecting the semiconductor chip and film carriers, and the process of sealing the semiconductor chip, can be performed at the same time, shortening the manufacturing time and reducing manufacturing cost.

Semiconductor device of multichip module-type

An improvement for a semiconductor device in which memory elements and logic elements are formed on the same substrate is disclosed. The semiconductor device is formed so that a concentration of the field inversion preventive layer below the field oxide film within the region where memory elements are formed is higher than a concentration of the field inversion preventive layer below the field oxide film within the region where logic elements are formed. For the method of manufacturing a semiconductor substrate according to this invention which realizes such a structure, there is a method of allowing the concentrations of field inversion preventive layers within the memory element region and within the logic element region to be differently changed, respectively, and a method of first forming field inversion preventive layers within the both regions so that they have a low concentration, and implementing ion-implantation only to the memory element region for a second time under the state where the logic element region is covered with resist, to thus provide an inversion preventive layer of high concentration.

Semiconductor device

Growing community of inventors

Tokyo, Japan

Katsuto Katoh