Nec Corporation

Sumitomo Bakelite Company Limited

Renesas Electronics Corporation

Katsushi Terajima

Masatoshi Iji

Yukihiro Kiuchi

Isao Katayama

Yasuo Matsui

Ken Oota

Hiroyuki Uchida

Yoshiaki Sato

Shinji Baba

Shuuichi Kariyazaki

Kazuyuki Nakagawa

Keita Tsuchiya

Toshiro Takeda

Yushi Sakamoto

Yuji Kayashima

Kenichi Kaneda

Sueo Morishige

Takashi Suzuki

According to an embodiment of the present invention, there is provided a semiconductor device having a first semiconductor component and a second semiconductor component which are mounted on a wiring substrate. The first semiconductor component has a first terminal for transmitting a first signal between the first semiconductor component and the outside and a second terminal for transmitting a second signal between the first semiconductor component and the second semiconductor component. In addition, the second semiconductor component has a third terminal for transmitting the second signal between the second semiconductor component and the first semiconductor component. Further, the first signal is transmitted at a higher frequency than the second signal. Furthermore, the second terminal of the first semiconductor component and the third terminal of the second semiconductor component are electrically connected to each other via the first wiring member. In addition, the first terminal of the first semiconductor component is electrically connected to the wiring substrate via a first bump electrode without the first wiring member interposed therebetween.

Semiconductor device

An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm) at 240&#xb1;20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1&#x2266;E&#x2266;0.27 W+21.8 in the case of 30&#x2266;W&#x3c;60, or a value satisfying 0.30 W&#x2212;13&#x2266;E&#x2266;3.7 W&#x2212;184 in the case of 60&#x2266;W&#x2266;95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.

Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler

Flame-retardant epoxy resin composition and semiconductor device made using the same

A metal cap involved in a cavity down mounting package to be subjected to a seam welding with at least a roller electrode, wherein the metal cap has a square like external shape with four corners being so rounded that each corner has a radius of curvature in the range from 1/10 to 3/8 of a length on each side of the square like shaped metal cap thereby the seam welding is carried out by a combination of a straight movement of the roller electrode along straight sides of the metal cap and adjacent part of the rounded corners to the straight sides and a rotary movement of the roller electrode around a center axis of the metal cap and the roller electrode moves along the rounded corners except adjacent portions to the straight side of the metal cap.

Cavity down mounting seam-welding ceramic package for semiconductor

A resin paste for tight sealing, comprising

Resin paste for tight sealing

Growing community of inventors

Tokyo, Japan

Katsushi Terajima