Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Matsushita Electronics Corporation

Katsushi Tara

Tadayoshi Nakatsuka

Kaname Motoyoshi

Shinji Fukumoto

Kenichi Hidaka

Masahiko Inamori

Atsushi Watanabe

Atsushi Suwa

Masanori Minamio

Toshiyuki Fukuda

Shinji Yamamoto

Kazuki Tateoka

Susumu Koike

Eiji Yasuda

Haruhiko Koizumi

Noboru Takeuchi

Fumihiko Kawai

Tsunehiro Takagi

Shuichi Ogata

Masao Nakayama

Yasuyuki Masumoto

Toshiharu Tambo

Kaoru Muramatsu

Toshio Fujiwara

Tomohiko Nakamura

Shotaro Umebachi

Isamu Yuasa

Noboru Yoshida

Tadashi Komatsu

Masahiro Hagio

Hidetaka Hashimoto

The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.

Resin encapsulated semiconductor device and method for manufacturing the same

The first terminals of a plurality of resistor elements are connected to the intermediate connection points of a plurality of FETs connected in series, and a voltage, having a phase opposite to that of the voltage applied to the gate terminals of the plurality of FETs, is applied to the second terminals of the plurality of resistor elements. With this configuration, the potentials at the intermediate connection points of the plurality of FETs connected in series can be prevented from lowering. As a result, the power that can be handled can be increased. Furthermore, since the potentials at the intermediate connection points of the plurality of FETs connected in series can be prevented from lowering, the deterioration of the distortion characteristic and the isolation characteristic owing to the lowering of the potentials at the intermediate connection points of the plurality of field-effect transistors connected in series is prevented, and excellent high-frequency characteristics are obtained.

High-frequency switching device and semiconductor

The present invention provides a miniaturized semiconductor device at low-cost having high integration density and for restraining an increase of an insertion loss and a deterioration of an isolation characteristic of a circuit resulting from parasitic inductance of gold wires. The semiconductor device includes a control semiconductor chip, a switch circuit semiconductor chip, a substrate, external terminals, gold wires and MIM capacitors. The control semiconductor chip controls a high frequency signal processing by the switch circuit semiconductor chip. The switch circuit semiconductor chip is mounted on the control semiconductor chip and processes the high frequency signal. The control semiconductor chip is mounted on the substrate. The external terminals are interfaces with the outside. The gold wires connect among the control semiconductor chip, the switch circuit semiconductor chip and the external terminals. The MIM capacitors are formed on the control semiconductor chip and the inside of the substrate, and process the high frequency signal.

Semiconductor device

A diode logic circuit which can select a high voltage from among the voltages of a number of control voltage input terminals using a number of diodes made of Schottky junctions is integrally formed on a compound semiconductor substrate on which MESFET stages for switching and for securing isolations have been formed. In addition, the MESFET stages for switching are controlled by the voltages of the number of control voltage input terminals and the MESFET stages for securing isolations are controlled by the OR voltage that is outputted from the diode logic circuit.

High frequency switching circuit device

High-frequency switching device and semiconductor device

A transistor integrated circuit apparatus generating less noise, having superb RF characteristics, and preventing thermal runaway of transistors is provided. Owing to capacitors Cthrough Chaving one end commonly connected to an RF signal input terminal RFin and the other end connected to a base electrode of a corresponding transistor, and inductors Lthrough Lhaving one end commonly connected to a DC power supply input terminal DCin and the other end connected to a base electrode of a corresponding transistor, RF noise generated in a DC power supply circuit is reduced. This can reduce the RF noise output from the transistors Trthrough Tr. The inductors Lthrough Lprevent an RF signal input from the RF input terminal RFin from flowing toward the DC power supply circuit. This can prevent the RF signal from being lost by the flow thereof toward the DC power supply circuit.

Transistor integrated circuit apparatus

A semiconductor apparatus is provided which makes it possible to reduce the number of control terminals required for switching through paths of a high frequency signal, simplify the circuit configuration for controlling the terminals, improve an isolation characteristic between on path and off path of a through FET, and obtain a sufficiently high isolation. In this semiconductor apparatus, one specific through FET and each of shunt FETs connected to each of through FETs other than the one specific through FET are simultaneously turned on in response to the same control signal inputted to the same control terminal. Thus, when a high frequency signal leaks from an output terminal to the signal path of the through FET having been turned on, through the signal paths of the through FETs having been turned off, the high frequency signal can be released to GND through the shunt FET having been turned on.

Semiconductor switching circuit for switching the paths of a high frequency signal in a mobile communications unit

Four switching circuit sections consisting of four FETs connected in series are provided between a plurality of input/output terminals which output and input a high frequency signal. Gate control voltages are individually applied to gate terminals of four FETs, respectively, so that an on-state and an off-state are achieved. Further drain control voltages are individually applied to drain terminals or source terminals of the FET in each switching circuit section, and a voltage according to an electric power value of the high frequency signal supplied to each of switching circuit sections is supplied as the gate control voltage and the drain control voltage.

High frequency switching circuit and semiconductor device

A field effect transistor switch circuit may include: () first, second, and third switch terminals; () a first field effect transistor, a pair of the main electrodes of which are connected respectively to the first switch terminal and the second switch terminal; and () a second field effect transistor, a pair of the main electrodes of which are connected respectively to the first switch terminal and the third switch terminal. A first resistor is connected between a control electrode and any one of the pair of the main electrodes of the first field effect transistor, and a second resistor is connected between a control electrode and any one of the pair of the main electrodes of the second field effect transistor.

Field effect transistor switch circuit

One end of each of five resistors is connected to each of the two ends and the respective intermediate points of a cascade of four depression-type FETs, while the other ends of the five resistors are provided with a predetermined voltage. This configuration fixes the source-drain potential of the four FETs. This fixing of the source-drain potential of the FETs permits stable application of a bias voltage for turning ON the FETs between the gate and the source each FET, so as to ensure the ON-OFF switching of the FETs.

High frequency switch circuit

The present invention provides a frequency conversion circuit capable of reducing current without impairing high frequency characteristics. A local oscillator amplifier is formed of a first field effect transistor. A source thereof is grounded by a first capacitor in terms of high frequency, and a gate thereof is connected to one end of each of first and second resistors. The other end of the first resistor is grounded, and the other end of the second resistor is connected to a voltage supply terminal. An intermediate frequency amplifier is formed of a second field effect transistor. A source thereof is grounded through a third resistor and a second capacitor that are connected in parallel with each other. A drain thereof is connected to an intermediate frequency signal output terminal through a third capacitor and an intermediate frequency output matching circuit. The source of the first field effect transistor and the drain of the second field effect transistor are connected through an AC blocking circuit.

Frequency conversion circuit

A high-frequency circuit is provided that can prevent the generation of an undesired peak and contribute to the reduction in area of a chip. The high-frequency circuit includes an amplifying block in which an amplifying element , a choke inductor , and a by-pass capacitor are provided, and an amplifying block in which an amplifying element , a choke inductor , and a by-pass capacitor are provided. Electric power is supplied from a common power terminal to the amplifying element via the choke inductor and to the amplifying element via the choke inductor and a resistive element . The amplifying elements and , the choke inductors and , the by-pass capacitors and , and the resistive element are formed on the same substrate.

High frequency circuit

The invention is directed to the provision of a two-input, four-output high frequency switch circuit that can prevent the occurrence of in-band ripples of insertion loss in an ON path. The high frequency switch circuit is constructed from six field effect transistors, and a signal is passed through a selected one of signal paths in the two-input, four-output high frequency signal switch having a total of six signal terminals, wherein four additional field effect transistors, each of which, when ON, provides a characteristic impedance matched to the characteristic impedance of an external circuit, are respectively connected between ground and the signal paths leading to the remaining four signal terminals to which the signal is not passed and which therefore become open ends. When the signal is not passed, the respective four field effect transistors are put in operation, thereby eliminating the effects of standing waves occurring on the respective paths leading to the four signal terminals acting as open ends.

High frequency switch circuit and communications terminal using the same

To achieve linear gain control (with a flatness of &plusmn;1 dB) over a wide range of 70 dB or greater using a single control voltage, an attenuator of the following configuration is provided in a radio frequency section of a transmitter of a cellular mobile telephone terminal. That is, a signal inputpart ( ) and signal output part ( ) for a radio frequency signal are connected by a signal line ( ) containing at least two series variable resistors ( and ); parallel variable resistors ( and ) are connected between a ground line ( ) and the signal inputpart ( ) and signal outputpart ( ), respectively; a gain control line ( ) is connected to the variable resistors ( , and ); reference voltage application parts ( , and ) are connected to the variable resistors ( , and ), respectively; and a gain control voltage application part ( ) is connected to each of the variable resistors ( , and ) via the gain control line ( ).

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Kyoto, Japan

Katsushi Tara