Kabushiki Kaisha Toshiba

Katsushi Nagaba

Shigeo Ohshima

Kazuko Inuzuka

Hiroyuki Koinuma

Kaoru Nakagawa

Tatsuo Ikawa

Atsushi Sueoka

Yasuyuki Kai

The data output circuit in a clock synchronous DRAM comprises a first data transfer circuit to which the data read from a memory is input and which transfers the input data to the output side in synchronization with an internal clock, an equalizing circuit to which the output of the first data transfer circuit is input during a read operation by a burst operation and to which high-impedance data is input after the read operation, a second data transfer circuit connected to the equalizing circuit, and an output buffer to which the output of the second data transfer circuit is input. The second data transfer circuit transfers all the data to the output buffer in synchronization with an output clock. This eliminates the dependence of the data access time and data hold time on data item and/or cycle and facilitates the timing control of the output control signal.

Semiconductor integrated circuit device

A semiconductor memory device capable of shortening data reading time in a first read cycle after the mode has been changed from a write mode to a read mode while maintaining high-speed cycle time when data is written despite simple structure, the semiconductor memory device having a memory cell array having a plurality of dynamic memory cells, to which data can be written, data line pairs to which data read from the memory cells and data which must be written on the memory cells are transferred, a write driver for driving the data line pairs in accordance with write data supplied from outside when data is written to the memory cells and an equalizing circuit for setting the data line pairs to an intermediate potential whenever the data line pairs are operated by the write driver.

Semiconductor memory device having synchronous write driver circuit

The present invention provides a semiconductor memory circuit capable of high-speed access to a predetermined column portion by a simplified high-speed addressing circuit. The memory circuit in a DRAM is such that a portion of a column addressing circuit normally comprising a counter constitutes a shift register in a column addressing circuit at a preceding stage of a column address buffer so that a plurality of address signal wrappings are realized for accessing the predetermined column portion.

Semiconductor memory circuit equipped with a column addressing circuit

The input pads DQ0 to DQ3 and the input buffers DIB0 to DIB3 are connected to each other by means of the wires La or Lb. In the case where the memory cell array is of the .times.4 bit pattern, the input pads DQ0 to DQ3 are connected to the input terminals of the input buffers DIB0 to DIB3, respectively, via the wires La, whereas in the case where the memory cell array is of the .times.1 bit pattern, one of the input pads, that is, DQ0 is connected to each of the input terminals of the input buffers DIB0 to DIB3 via the wires Lb. The structures from the input buffers DIB0 to DIB3 to the memory cell arrays are the same and common to the .times.4 bit pattern and the .times.1 bit pattern, and therefore an increase in the driving performance of the transistors in the input buffers DIB0 to DIB3 can be suppressed.

Semiconductor integrated circuit having improved wiring in input terminal

A semiconductor integrated circuit device having a high-efficiency transfer gate and which is applicable to a DRAM which has voltage-raised word lines configured from a data retention node, a data line that is precharged to a required level, a MOS transistor with the source and the drain each connected to a data line and a data retention node, a sense amplifier that amplifies the data that has been transferred to the data line via this MOS transistor a step-up circuit that applies a voltage that is higher than the drain voltage when compared with an absolute value, to the gate of the MOS transistor, and a step-down circuit for reducing the absolute value of a gate voltage of the MOS transistor at the timing of activation of the sense amplifier.

Semiconductor integrated circuit device for high-speed transmission of

A dynamic memory having pairs of bit lines. A sense amplifier is connected between each pair of bit lines for detecting data from the potential difference between these bit lines. The memory further comprises first and second pair of dummy word lines. A capacitor is coupled between the first of each pair of bit lines, on the one hand, and the first pair of dummy word lines, on the other. Similarly, a capacitor is coupled between the second of each pair of bit lines, on the one hand, and the second pair of dummy word lines, on the other. A first dummy word line driver is connected to the first pair of dummy word lines, for generating a reference potential in the first of each pair of bit lines. A second dummy word line driver is connected to the second pair of dummy word lines, for generating a reference potential in the second of each pair of bit lines. The memory also has a selection circuit for selecting either the first or second dummy word line driver. During a precharging period, either dummy word line driver sets both pairs of dummy word lines at a precharging potential. During a data-reading period, the dummy word line driver selected by the selection circuit sets the dummy word lines at a high potential and a low potential, respectively, and the dummy word line driver selected by the selection circuit sets both dummy word lines at a precharging potential.

Dynamic memory

A first circuit is made up of a first clocked inverter and a first modified clocked inverter. A second circuit is made up of a second clocked inverter and a second modified clocked inverter. The first circuit has substantially the same circuit arrangement as that of the second circuit. The first circuit operates in response of the output signal from the second circuit, and vice versa.

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Kawasaki, Japan

Katsushi Nagaba