Nagase Chemtex Corporation

Katsushi Kan

Yosuke Oi

Eiichi Nomura

Takayuki Hashimoto

Takashi Hiraoka

Yukio Yada

Yasuhito Fujii

Daisuke Mori

Masahiro Asahara

Yukari Kouno

Takeyuki Kitagawa

[Problem] To provide a multi-layer sheet for mold underfill encapsulation, which exhibits good infiltrability between electrodes. [Solution] In order to solve the aforementioned problem, the present invention provides a multi-layer sheet for mold underfill encapsulation, which is characterized by having provided as an outermost layer thereof an (A) layer that comprises a resin composition having a local maximum loss tangent (tan δ) value of 3 or more at a measurement temperature of 125° C. for a measurement time of 0-100 seconds.

Multi-layer sheet for mold underfill encapsulation, method for mold underfill encapsulation, electronic component mounting substrate, and production method for electronic component

A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

Curable resin composition and curable sheet

To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 &#x3bc;m observed within a 25-mmarea is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

Epoxy resin composition, electronic component mounting structure, and method for producing the same

There are provided an epoxy resin composition for encapsulation, which is particularly suitable for use in resin pre-setting type flip-chip mounting of a Cu post chip, and which is capable of suppressing defects due to the generation of voids; and a method for manufacturing a semiconductor device using a Cu post chip. The present invention provides an epoxy resin composition for semiconductor encapsulation for flip-chip mounting, which contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and 3 to 64 parts by weight, relative to 100 parts by weight of the component (A), of thermally thickening resin particles (D) having a volume-average primary particle diameter of 0.2 to 10 &#x3bc;m; and a method for manufacturing a semiconductor device by resin pre-setting type flip-chip mounting of a Cu post chip using the composition.

Epoxy resin composition for semiconductor encapsulation and method for manufacturing semiconductor device

Growing community of inventors

Tatsuno, Japan

Katsushi Kan