Jx Metals Corporation

Jx Nippon Mining & Metals Corporation

Jx Advanced Metals Corporation

Jx Nippon Mining & Metals Copporation

Katsushi Aoki

Hidetoshi Sasaoka

Tsubasa Takeda

Yujiro Tokita

Norimasa Ohtsuka

Provided is a method for processing electronic and electrical device component scrap, which can increase an amount of electronic and electrical device component scrap processed in a smelting step and efficiently recover valuable metals. The method for processing electronic and electrical device component scrap includes: a stepof removing powdery materials and film-shaped component scrap from the electronic and electrical device component scrap; a stepof concentrating synthetic resins and substrates from the electronic and electrical device component scrap from which the powdery materials and film-shaped component scrap have been removed; and a stepof concentrating the substrates containing valuable metals from a concentrate obtained in the step

Method for processing electronic and electrical device component scrap

Provided is a method for processing electronic and electrical device component scrap according to an embodiment of the present invention includes a smelting raw material sorting step of sorting a processing raw material containing valuable metals processable in a smelting step from the electronic and electrical device component scrap, wherein the method comprises removing lump copper wire scrap contained in the electronic and electrical device component scrap using a parallel link robot.

Processing method and processing device for electronic/electrical device component scrap

Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes sorting electronic and electrical device component scrap by wind powder sorting to remove plate-shaped materials containing valuable metals included in the electronic and electrical device component scrap, and then sorting the resulting sorted objects by magnetic sorting.

Method for processing electronic and electric device component scraps

Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes removing powdery objects contained in electronic and electrical device component scrap prior to a step of separating non-metal objects or metal objects from the electronic and electrical device component scrap containing the metal objects and the non-metal objects, using a metal sorter including: a metal sensor, a color camera, an air valve, and a conveyor.

Method for processing electronic/electrical device component scraps

Provided is a sorting machine capable of more easily and efficiently sorting specific parts having a specific shape from raw materials containing various substances having different shapes, and a method for treating electronic and electric device component scraps using the sorting machine. The sorting machine includes a conveying devicehaving a conveying surfacewhich conveys raw materials containing substances having different shapes from a raw material inletto a receiving port; and a gate deviceprovided with a cylindrical roll portionhaving a rotating function arranged at a certain distance d on the conveying surface to allow at least a part of the raw materialsto pass through to the receiving port

Sorting machine and method for treating electronic/electric device component scraps

Provided are a raw material discharge device, a method of processing an electronic and electrical device component scrap, and a raw material discharging method of an electronic and electrical device component scrap, which are capable of efficiently discharging the raw material having various shapes, specific gravities and shapes in each fixed amount. A raw material discharge device including: a storage unitwhich stores a raw material and comprising a discharge portat one end; a discharge unitarranged at a bottom surfaceof the storage unit, which conveys the raw material toward the discharge portand discharges the raw material to an outside of the storage unit; an adjustment unitincluding a plurality of strutsextending from above to below the discharge unitand adjusting an amount of the raw material to be discharged by holding a part of the raw material with the struts; wherein a ratio (d/d) of a distance (d) between a strutclosest to a side surfaceof the storage unitand the side surfaceof the storage unitto a narrowest distance (d) between the strutsin a center portion of the storage unit, and a ratio (H/H) of a height of the strutclosest to the side surfaceof the storage unitfrom a floor to a minimum height (H) of a strutwhich is other than the strutclosest to the side surface of the storage unitfrom the floor are respectively adjustable so as to prevent clogging of the raw material being discharged to the outside of the storage unit

Raw material discharge device, method of processing of electronic/electrical device component scrap, and method of raw material discharge for electronic/electrical device component scrap

Provided is a method for removing a linear object, a device for removing a linear object, and a method for processing electronic/electrical equipment component waste, which can improve separation efficiency. The method for removing linear objects including: arranging a plurality of filtersin a vibrating sieve machinesuch that the filtersare adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filterscomprising a plurality of rodsextending at distances in the feed direction of the raw material and a beam portionsupporting the plurality of rodsat one ends of the plurality of the rods, the other ends of the plurality of the rodsbeing free ends; arranging a guidebelow a tip of one of the filterslocated on a most downstream side in the feed direction; feeding the raw material containing at least linear objects and plate-form objects into the vibrating sieve machine; and sorting the linear objects and the plate-form objects by vibrating the filters, sieving the linear objects to an under-sieve side of the vibrating sieve machine, and capturing lumpy linear objects with the guide.

Method for removing linear objects, device for removing linear objects, and method for processing electronic/electrical equipment component waste

Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.

A raw material supply device and a device for processing electronic and electrical device part scraps, which can control dropping positions of a raw material containing substances having different shapes and specific gravities, and a method for processing electronic and electrical device part scraps using those devices. The raw material supply device includes a receiving port, a discharge port, a first guide surface, and a second guide surface on a surface opposing to the first guide surface. The processing device includes a first conveying unit, a raw material supply device, a second conveying unit, and a pyramid-shaped disperser. The processing method comprises a sorting step, wherein the sorting step comprises dropping the electronic and electrical device part scraps onto a plurality of dispersion surfaces of a pyramid-shaped disperser, and dispersing the electronic and electrical device part scraps in a plurality of directions on a conveying surface.

Raw material supply device, device for processing electronic and electrical device part scraps, and method for processing electronic and electrical device part scraps

Provided is a method for processing electronic and electrical device component scrap, which can accurately and efficiently sort electronic and electrical device component scrap. The method for processing electronic and electrical device component scrap includes a separation step of separating non-metal objectsor metal objectsfrom electronic and electrical device component scrapcontaining the metal objectsand the non-metal objectsusing a sortercomprising a metal sensor, a color camera, an air valve, and a conveyor, wherein a fixed distance is provided between the metal objectsadjacent to each other so as to prevent the non-metal objectsbetween the metal objectsfrom being erroneously detected, when detecting the metal objectsin the electronic and electrical device component scrapby the metal sensor

Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a filter in a vibrating sieve machine, the filter including a plurality of rods extending at distances in a feed direction of a raw material; and placing a raw material containing at least wire-form objects and plate-form objects onto the filter, and vibrating the filter to sieve out the wire-form objects under a sieve.

Method for removing wire-form objects, device for removing wire-form objects, and method for processing electronic/electrical apparatus component scrap

Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a plurality of filtersin a vibrating sieve machinesuch that the filtersare adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters including a plurality of rodsextending at distances in the feed direction and a beam portionfor supporting the plurality of rodsat one endsof the plurality of rods, the other endsof the plurality of rodsbeing free ends; and feeding a raw material containing at least wire-form objects and plate-form objects into the vibrating sieve machine; and vibrating the filtersto sieve out the wire-form objects toward an under-sieve side of the vibrating sieve machine

Growing community of inventors

Hitachi, Japan

Katsushi Aoki